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公开(公告)号:US08993098B2
公开(公告)日:2015-03-31
申请号:US13217556
申请日:2011-08-25
CPC分类号: B29C45/1676 , B29C45/34 , B29C2045/1682 , B29L2031/104 , E04F15/02172 , E04F15/105 , E04F2201/0146 , E04F2201/021 , Y10T428/24339 , Y10T428/24347 , Y10T428/24612 , Y10T428/24752 , Y10T428/24802 , Y10T428/24942 , Y10T428/24983
摘要: A modular plastic floor tile has a body of a first polymer compound and at least one upper feature overmolded onto an upper surface of the body from a second polymer compound which is injected from a gate adjacent the lower surface of the body. At least one through-hole communicates the gate to the upper feature. At least one vent hole, spaced from the through-hole, communicates the upper feature to the lower surface of the body. The vent hole allows any gas in the polymer flow path to be displaced from the upper feature, thereby preventing or minimizing defects that can affect adhesion and appearance.
摘要翻译: 模块化塑料地板瓦片具有第一聚合物化合物的主体和至少一个上部特征,所述至少一个上部特征从第二聚合物化合物覆盖在主体的上表面上,所述第二聚合物化合物从邻近所述主体的下表面的门喷射。 至少一个通孔将门连接到上部特征。 与通孔间隔开的至少一个通气孔将上部特征连通到身体的下表面。 通气孔允许聚合物流动路径中的任何气体从上部特征位移,从而防止或最小化可能影响粘附和外观的缺陷。
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公开(公告)号:US08640403B2
公开(公告)日:2014-02-04
申请号:US13687705
申请日:2012-11-28
CPC分类号: E04F15/105 , B32B3/263 , B32B3/30 , B32B7/02 , E01C5/226 , E01C13/045 , E01C2201/12 , E04F15/0215 , E04F15/02172 , E04F15/02194 , E04F2201/0146 , E04F2201/021 , Y10T428/24339 , Y10T428/24347 , Y10T428/24612 , Y10T428/24752 , Y10T428/24802 , Y10T428/24942 , Y10T428/24983
摘要: A modular plastic floor tile has a body of a first polymer compound and features overmolded onto the body from a second polymer compound. The compounds may be different from each other in hardness and/or color. The features may include skins on support member cores disposed below the tile lower surface. The skins adhere to the bottom and at least a portion of the sidewall of the support member core.
摘要翻译: 模块化塑料地板砖具有第一高分子化合物的主体,并且具有从第二聚合物化合物包覆成型到主体上的特征。 化合物在硬度和/或颜色上可以彼此不同。 特征可以包括设置在瓦片下表面下方的支撑构件芯上的表皮。 表皮粘附到支撑构件芯的底部和侧壁的至少一部分。
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公开(公告)号:US09339981B2
公开(公告)日:2016-05-17
申请号:US13705270
申请日:2012-12-05
IPC分类号: B29D99/00 , E01C5/22 , E01C13/04 , E04F15/02 , E04F15/10 , E04F15/00 , B29C45/14 , B29C45/16
CPC分类号: B29D99/0057 , B29C45/14344 , B29C2045/14368 , B29C2045/14967 , B29C2045/1681 , E01C5/226 , E01C13/045 , E01C2201/12 , E01C2201/16 , E04F15/02038 , E04F15/02172 , E04F15/02183 , E04F15/02194 , E04F15/105 , E04F2201/0146 , E04F2201/021
摘要: A modular plastic floor tile is formed by molding a body of a first polymer compound and overmolding features onto the body from a second polymer compound. The compounds may be different from each other in hardness and/or color. The overmolded features may include skins on the sides and bottoms of support member cores disposed below the tile lower surface.
摘要翻译: 通过将第一聚合物化合物的主体和包覆成型特征从第二聚合物化合物模制到主体上而形成模块化塑料地板砖。 化合物的硬度和/或颜色可以彼此不同。 包覆成型的特征可以包括设置在瓦片下表面下方的支撑构件芯的侧面和底部的表面。
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公开(公告)号:US09180640B2
公开(公告)日:2015-11-10
申请号:US13705250
申请日:2012-12-05
CPC分类号: B29D99/0057 , E01C5/226 , E01C13/045 , E01C2201/12 , E01C2201/16 , E04F15/02172 , E04F15/02194 , E04F15/105 , E04F2201/0146 , E04F2201/021
摘要: A plastic floor tile is formed by molding a body of a first polymer compound and overmolding features onto the body from a second polymer compound. The compounds may be different from each other in hardness and/or color. The overmolded features may include raised pads on the upper surface of the tile. The pads on the upper surface may be injection-molded from the lower surface through through-holes, which are smaller in area than the area of the pads.
摘要翻译: 通过将第一聚合物化合物的主体和包覆成型特征从第二聚合物化合物模制到主体上而形成塑料地板砖。 化合物的硬度和/或颜色可以彼此不同。 包覆成型的特征可以包括在瓦片的上表面上的凸起垫。 上表面上的焊盘可以从下表面注入模制,该通孔的面积小于焊盘的面积。
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