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公开(公告)号：US20130240113A1
公开(公告)日：2013-09-19
申请号：US13878570
申请日：2011-10-05
IPC分类号： H01L21/02
CPC分类号： B65G47/00 , H01L21/02002 , H01L21/67173 , H01L21/67201 , Y10T156/10
摘要： The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
摘要翻译： 本发明涉及一种用于使用至少一个预处理模块，至少一个后处理模块和至少一个主处理模块来处理衬底，特别是晶片的装置，并且预处理模块和后处理模块可以切换为用于 初级处理模块，以及用于处理基板，特别是晶片的相应方法。
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公开(公告)号：US09751698B2
公开(公告)日：2017-09-05
申请号：US13878570
申请日：2011-10-05
CPC分类号： B65G47/00 , H01L21/02002 , H01L21/67173 , H01L21/67201 , Y10T156/10
摘要： The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
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公开(公告)号：US20150047783A1
公开(公告)日：2015-02-19
申请号：US14386046
申请日：2012-03-19
CPC分类号： H01L21/67121 , B23K20/023 , B23K20/22 , B23K2101/40 , H01L21/67092
摘要： A pressure transfer plate for transferring a bonding pressure, especially in thermocompression bonding, from a pressurization apparatus to a wafer, comprising a first pressure side for making contact with a pressurization apparatus, a second pressure side facing away from the first pressure side having an effective contact area for making contact with the wafer and pressurizing it, at least the effective contact area having a low adhesiveness relative to the wafer.
摘要翻译： 一种压力传递板，用于将加压装置中的粘合压力特别是热压接合传递到晶片，包括与加压装置接触的第一压力侧，远离第一压力侧的第二压力侧具有有效的 与晶片接触并对其加压的接触区域，至少相对于晶片具有低粘合性的有效接触面积。
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