公开(公告)号：US06699055B2

公开(公告)日：2004-03-02

申请号：US10286051

申请日：2002-11-01

申请人： Fu Jin Peng ,  Nick Lin ,  Ren-Chih Li ,  Jian Zhang

发明人： Fu Jin Peng ,  Nick Lin ,  Ren-Chih Li ,  Jian Zhang

IPC分类号： H01R450

CPC分类号： H01R12/82

摘要： An electrical connector (1) includes: an insulative base (10) having a top surface (104), a bottom surface (103), and a plurality of passageways (101); a cover (12) slidably mounted on the base; a plurality of conductive terminals (16) received in the passageways; and an actuating device (14). Each passageway is bounded by two opposite first walls (1018), two opposite second walls (1019), and a bottom wall (1013). Each first wall defines a through slot (1011), and one of the second walls forms a slanted guiding portion (1012) spanning from the top surface to adjacent the bottom wall. The bottom wall forms a chamfer portion (1014). The guiding portion and the chamfer portion cooperate to protect the corresponding terminal and the base from damage when the terminal is inserted into the passageway.

摘要翻译： 电连接器（1）包括：具有顶表面（104），底表面（103）和多个通道（101）的绝缘基座（10）; 可滑动地安装在基座上的盖子（12） 容纳在通道中的多个导电端子（16）; 和致动装置（14）。 每个通道由两个相对的第一壁（1018），两个相对的第二壁（1019）和底壁（1013）限定。 每个第一壁限定通孔（1011），并且第二壁中的一个形成从顶表面邻近底壁的倾斜的引导部分（1012）。 底壁形成倒角部分（1014）。 当端子插入通道时，引导部分和倒角部分协作以保护相应的端子和基座免受损坏。

公开(公告)号：US20050042897A1

公开(公告)日：2005-02-24

申请号：US10925286

申请日：2004-08-23

申请人： Jian Zhang ,  Nick Lin

发明人： Jian Zhang ,  Nick Lin

IPC分类号： H01R12/16 ,  H01R13/24 ,  H01R12/00

CPC分类号： H01R12/88

摘要： A land grid array connector (1) for electrically connecting a CPU package (3) to a printed circuit board comprises a housing (2) and a number of contacts (23) received in passageways (22) of the housing. The housing has a floor (20) and sidewalls (24,26). The floor and the sidewalls cooperatively define a receiving space for accommodating the package. Block member (269) is formed on inner side of the sidewalls of the housing for protecting inner surface of the sidewalls of the housing from scraping damage during insertion of the package into the housing and during extraction of the package from the housing. Reliable electrical connection between the package and contacts of the land grid array connector is secured.

摘要翻译： 用于将CPU封装（3）电连接到印刷电路板的焊盘格栅阵列连接器（1）包括壳体（2）和容纳在壳体的通道（22）中的多个触点（23）。 壳体具有底板（20）和侧壁​​（24,26）。 地板和侧壁协同地限定用于容纳包装的容纳空间。 块体构件（269）形成在壳体的侧壁的内侧，用于在将包装插入壳体期间以及在从壳体提取包装件期间保护壳体的侧壁的内表面免受刮擦损坏。 封装和焊盘栅格阵列连接器的触点之间的可靠电连接得到保证。

公开(公告)号：US07101210B2

公开(公告)日：2006-09-05

申请号：US11288730

申请日：2005-11-28

申请人： Nick Lin ,  Jian Zhang ,  Yu-Chen Chen

发明人： Nick Lin ,  Jian Zhang ,  Yu-Chen Chen

IPC分类号： H01R13/62

CPC分类号： H05K7/12 ,  H05K7/1061

摘要： Disclosed is a LGA socket connector including an insulative housing (2), a stiffener (3), a clip (4), and a lever (5) defining thereof a driving portion (50) and a locking portion (52) linked thereto. The stiffener is configured to grasp a periphery of the housing. The clip and the locking portion of the lever are essentially pivotally moved about longitudinal ends of the housing respectively, but with the driving portion disposed adjacent one transverse side of the housing. At least one of the clip and the stiffener is provided with a recessed region (300) adjacent said transverse side of the housing, thereby preventing the whole connector from becoming inclined when the connector is horizontally locked and placed on the printed circuit board.

摘要翻译： 公开了一种LGA插座连接器，其包括绝缘壳体（2），加强件（3），夹子（4）和限定有驱动部分（50）的杠杆（5）和与其连接的锁定部分（52）。 加强件构造成抓住壳体的周边。 杠杆的夹子和锁定部分分别基本上围绕壳体的纵向端部枢转地移动，但是驱动部分邻近壳体的一个横向侧面设置。 夹子和加强件中的至少一个设置有与壳体的所述横向侧相邻的凹陷区域（300），从而当连接器水平地锁定并放置在印刷电路板上时，防止整个连接器变得倾斜。

公开(公告)号：US20060116012A1

公开(公告)日：2006-06-01

申请号：US11288730

申请日：2005-11-28

申请人： Nick Lin ,  Jian Zhang ,  Yu-Chen Chen

发明人： Nick Lin ,  Jian Zhang ,  Yu-Chen Chen

IPC分类号： H01R13/44

CPC分类号： H05K7/12 ,  H05K7/1061

摘要： Disclosed is a LGA socket connector including an insulative housing (2), a stiffener (3), a clip (4), and a lever (5) defining thereof a driving portion (50) and a locking portion (52) linked thereto. The stiffener is configured to grasp a periphery of the housing. The clip and the locking portion of the lever are essentially pivotally moved about longitudinal ends of the housing respectively, but with the driving portion disposed adjacent one transverse side of the housing. At least one of the clip and the stiffener is provided with a recessed region (300) adjacent said transverse side of the housing, thereby preventing the whole connector from becoming inclined when the connector is horizontally locked and placed on the printed circuit board.

公开(公告)号：US20050059288A1

公开(公告)日：2005-03-17

申请号：US10940283

申请日：2004-09-13

申请人： Nick Lin ,  Jian Zhang ,  Huayin Huang

发明人： Nick Lin ,  Jian Zhang ,  Huayin Huang

IPC分类号： H01R12/16 ,  H01R13/62 ,  H01R4/50 ,  H01R13/625

CPC分类号： H01R12/88

摘要： An electrical connector (1) for interconnecting an LGA chip (60) with a PCB includes an dielectric housing (10) defining a number of terminal passageways (16) with a plurality of electrical contacts (12) accommodated therein, a metal reinforcement (20) enclosing the housing (10) partly, a loading plate (40) pivotally mounted to an end of the reinforcement (20), and an actuator member (30) attached to an opposite end of the reinforcement (20) for engaging with the loading plate (40). The loading plate (40) defines a pair of pressing portions (43) to press the chip (60) against the connector (1). The pressing portion (43) defines some flexible materials (431) on the bottom surface (430) toward the housing (10) for protecting the chip (60) from being scraped by the loading plate (40).

摘要翻译： 用于将LGA芯片（60）与PCB互连的电连接器（1）包括限定多个容纳在其中的多个电触头（12）的端子通道（16）的电介质外壳（10），金属加强件 ）部分地封装所述壳体（10），可枢转地安装到所述加强件（20）的端部的装载板（40）和附接到所述加强件（20）的相对端的致动器构件（30），用于与所述加载 板（40）。 装载板（40）限定一对按压部分（43）以将芯片（60）压靠在连接器（1）上。 按压部分（43）在底表面（430）上朝向壳体（10）限定一些柔性材料（431），用于保护芯片（60）免受装载板（40）的刮擦。

公开(公告)号：USD980356S1

公开(公告)日：2023-03-07

申请号：US29844017

申请日：2022-06-25

申请人： Jian Zhang

设计人： Jian Zhang

公开(公告)号：US11524401B1

公开(公告)日：2022-12-13

申请号：US16829277

申请日：2020-03-25

申请人： Jian Zhang ,  Mario J. Srouji ,  Ruslan Salakhutdinov

发明人： Jian Zhang ,  Mario J. Srouji ,  Ruslan Salakhutdinov

IPC分类号： G05B19/04 ,  B25J9/16 ,  G06T7/20 ,  G06N20/00 ,  G06N5/04 ,  G05B13/02

摘要： A method includes determining motion imitation information for causing a system to imitate a physical task using a first machine learning model that is trained using motion information that represents a performance of the physical task, determining a predicted correction based on the motion information and a current state from the system using a second machine learning model that is trained using the motion information, determining an action to be performed by the system based on the motion imitation information and the predicted correction; and controlling motion of the system in accordance with the action.

公开(公告)号：US20220005720A1

公开(公告)日：2022-01-06

申请号：US16873779

申请日：2020-07-02

申请人： Jian Zhang

发明人： Jian Zhang

IPC分类号： H01L21/68 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683 ,  H01L23/00

摘要： The present invention comprises an arrangement and process for the fluxless manufacture of an integrated circuit component, comprising the steps of loading a solder ball and chip arrangement, solder ball side up or down, onto a first or a second donor chuck respectively; monitoring the solder ball and chip arrangement by a computer-controlled camera; removing the solder ball and chip arrangement from the donor chuck by a computer-controlled gripper mechanism; moving the solder ball and chip arrangement via the gripper mechanism onto a computer-controlled gang carrier, the monitored by a second computer controlled camera; flipping the gang carrier about a horizontal axis so as to arrange the solder ball and chip arrangement into an inverted, solder ball side down orientation over a receiver chuck substrate, monitored and positionally controlled by a third computer-controlled camera; and compressing the solder ball side down solder ball and chip arrangement onto the receiver chuck substrate by a computer-controlled compression rod so as to bond the solder ball side down solder ball and chip arrangement onto the receiver chuck substrate so as to form an integrated circuit assembly.

公开(公告)号：USD818726S1

公开(公告)日：2018-05-29

申请号：US29599093

申请日：2017-03-31

申请人： Jian Zhang

设计人： Jian Zhang

公开(公告)号：US09510253B2

公开(公告)日：2016-11-29

申请号：US13520792

申请日：2010-04-26

申请人： Lifeng Han ,  Yin Gao ,  Longtao Ren ,  Jian Zhang ,  Shengyao Jin

发明人： Lifeng Han ,  Yin Gao ,  Longtao Ren ,  Jian Zhang ,  Shengyao Jin

IPC分类号： H04W36/08 ,  H04W36/00 ,  H04W92/20

CPC分类号： H04W36/08 ,  H04W36/0005 ,  H04W36/0016 ,  H04W36/0055 ,  H04W92/20

摘要： The present disclosure provides a method for determining a reason for too late handover to a Home eNB (HeNB), and the method includes that: after completing the re-establishment link of Radio. Resource Control (RRC) with User Equipment (UE), the HeNB confirms that a Radio Link Failure (RLF) event occurs when the UE is connected with a cell of another eNodeB; the HeNB generates an RLF Indication message and transmits the RLF Indication message to the another eNodeB, wherein the RLF Indication message includes information of a Closed Subscriber Group (CSG) cell currently accessed by the UE; the another eNodeB determines the reason for too late handover of the UE to the HeNB according to the RLF Indication message. The disclosure also provides a system for determining the reason for too late handover to the HeNB. The present disclosure can determine a specific reason for the RLF, and thereby, can be more useful for improving the configuration of related parameters at the network side.

摘要翻译： 本公开提供了一种用于确定到家庭eNB（HeNB）的切换过晚的原因的方法，并且该方法包括：完成无线电的重新建立链路之后。 资源控制（RRC）与用户设备（UE），HeNB确认当UE与另一个eNodeB的小区连接时，发生无线链路故障（RLF）事件; HeNB生成RLF指示消息并将RLF指示消息发送到另一个eNodeB，其中RLF指示消息包括UE当前访问的封闭用户组（CSG）小区的信息; 另一个eNodeB根据RLF指示消息确定UE到HeNB的切换过晚的原因。 本公开还提供了一种用于确定到HeNB切换过晚的原因的系统。 本公开可以确定RLF的特定原因，从而可以更有用于改善网络侧的相关参数的配置。