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公开(公告)号:US20150002980A1
公开(公告)日:2015-01-01
申请号:US14489478
申请日:2014-09-18
申请人: Fu-Min Hsu , Chih-Jung Teng , Kuo-Chang Su , Chin-Liang Chen
发明人: Fu-Min Hsu , Chih-Jung Teng , Kuo-Chang Su , Chin-Liang Chen
IPC分类号: H05F3/04
CPC分类号: H05F3/04 , H05K5/0243
摘要: A decoration plate and an electronic apparatus having the same are provided. The decoration plate includes a cover plate, a conductive ring, an insulating layer, and a conductive element. The conductive ring is disposed on a surface of the cover plate. The insulating layer is disposed on the surface of the cover plate and covers the conductive ring, and the insulating layer has at least one opening. The conductive element is disposed in the opening.
摘要翻译: 提供了装饰板和具有该装饰板的电子装置。 装饰板包括盖板,导电环,绝缘层和导电元件。 导电环设置在盖板的表面上。 绝缘层设置在盖板的表面上并覆盖导电环,并且绝缘层具有至少一个开口。 导电元件设置在开口中。
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公开(公告)号:US20120127686A1
公开(公告)日:2012-05-24
申请号:US13303147
申请日:2011-11-23
申请人: Fu-Min Hsu , Chih-Jung Teng , Kuo-Chang Su , Chin-Liang Chen
发明人: Fu-Min Hsu , Chih-Jung Teng , Kuo-Chang Su , Chin-Liang Chen
CPC分类号: H05F3/04 , H05K5/0243
摘要: A decoration plate and an electronic apparatus having the same are provided. The decoration plate includes a cover plate, a conductive ring, an insulating layer, and a conductive element. The conductive ring is disposed on a surface of the cover plate. The insulating layer is disposed on the surface of the cover plate and covers the conductive ring, and the insulating layer has at least one opening. The conductive element is disposed in the opening.
摘要翻译: 提供了装饰板和具有该装饰板的电子装置。 装饰板包括盖板,导电环,绝缘层和导电元件。 导电环设置在盖板的表面上。 绝缘层设置在盖板的表面上并覆盖导电环,并且绝缘层具有至少一个开口。 导电元件设置在开口中。
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公开(公告)号:US08873248B2
公开(公告)日:2014-10-28
申请号:US13303147
申请日:2011-11-23
申请人: Fu-Min Hsu , Chih-Jung Teng , Kuo-Chang Su , Chin-Liang Chen
发明人: Fu-Min Hsu , Chih-Jung Teng , Kuo-Chang Su , Chin-Liang Chen
CPC分类号: H05F3/04 , H05K5/0243
摘要: A decoration plate and an electronic apparatus having the same are provided. The decoration plate includes a cover plate, a conductive ring, an insulating layer, and a conductive element. The conductive ring is disposed on a surface of the cover plate. The insulating layer is disposed on the surface of the cover plate and covers the conductive ring, and the insulating layer has at least one opening. The conductive element is disposed in the opening.
摘要翻译: 提供了装饰板和具有该装饰板的电子装置。 装饰板包括盖板,导电环,绝缘层和导电元件。 导电环设置在盖板的表面上。 绝缘层设置在盖板的表面上并覆盖导电环,并且绝缘层具有至少一个开口。 导电元件设置在开口中。
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公开(公告)号:US20130038545A1
公开(公告)日:2013-02-14
申请号:US13533968
申请日:2012-06-27
申请人: Fu-Min Hsu , Chih-Jung Teng , Kuo-Chang Su , Chih-Yao Fang
发明人: Fu-Min Hsu , Chih-Jung Teng , Kuo-Chang Su , Chih-Yao Fang
IPC分类号: G06F3/041
CPC分类号: G06F3/041
摘要: A touch-sensing panel including a substrate, a logo pattern, a decoration layer, and a touch-sensing element is provided. The logo pattern is disposed on the substrate. The decoration layer is disposed on surface periphery of the substrate, wherein the logo pattern is disposed between the substrate and the logo pattern. The touch-sensing element is disposed on the substrate. In this way, the layout and the fabrication margins of the touch-sensing panel are increased, and the design sense of the touch-sensing panel is enhanced. Besides, a touch-sensing display apparatus having the above touch-sensing panel is also provided.
摘要翻译: 提供了包括基板,徽标图案,装饰层和触摸感测元件的触摸感测面板。 标志图案设置在基板上。 装饰层设置在基板的表面周边,其中标志图案设置在基板和标志图案之间。 触摸感测元件设置在基板上。 以这种方式,增加了触摸感应面板的布局和制造裕度,并提高了触摸感应面板的设计感。 此外,还提供了具有上述触摸感测面板的触摸感测显示装置。
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公开(公告)号:US08481144B2
公开(公告)日:2013-07-09
申请号:US12903693
申请日:2010-10-13
申请人: Fu-Min Hsu , Chin-Liang Chen , Ping-Wen Huang , Ming-Chuan Lin , Shih-Cheng Wang , Chia-Hung Yeh , Cheng-Shao Lu
发明人: Fu-Min Hsu , Chin-Liang Chen , Ping-Wen Huang , Ming-Chuan Lin , Shih-Cheng Wang , Chia-Hung Yeh , Cheng-Shao Lu
CPC分类号: G02B5/045 , B44F1/08 , B44F7/00 , Y10T428/24355 , Y10T428/24521 , Y10T428/24545 , Y10T428/24917 , Y10T428/31507 , Y10T428/31786 , Y10T428/31935
摘要: A complex sheet structure includes a base plate, a microstructure layer, and a shielding layer. The microstructure layer is formed on the base plate and has a first side and an opposite second side. The microstructure layer has a plurality of prismatic structures, and the base plate touches the first side of the microstructure layer. The shielding layer covers the second side of the microstructure layer and contains a low light-transmittance material.
摘要翻译: 复合片结构包括基板,微结构层和屏蔽层。 微结构层形成在基板上并具有第一侧和相对的第二侧。 微结构层具有多个棱柱结构,底板接触微结构层的第一侧。 屏蔽层覆盖微结构层的第二面,并含有低透光性材料。
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公开(公告)号:US20090257246A1
公开(公告)日:2009-10-15
申请号:US12421006
申请日:2009-04-09
申请人: Fu-Min Hsu , Tien-Nan Wang , Chin-Liang Chen , Chen-Shao Lu , Ming-Da Chen , Chin-Wei Huang
发明人: Fu-Min Hsu , Tien-Nan Wang , Chin-Liang Chen , Chen-Shao Lu , Ming-Da Chen , Chin-Wei Huang
IPC分类号: F21V15/015
CPC分类号: G02B6/0088
摘要: A back light module including a frame, a light-guide plate and a light source is provided. The frame has a opening and a first surface and a second surface opposite to the first surface. The opening is extended from the first surface to the second surface of the frame, so that an inner surface of the opening is connected to the first surface and the second surface. At least a portion of the inner surface is slanted toward the inner of the opening. The light-guide plate is integrated with the frame and at least a portion of the opening is filled with the light-guide plate. The light-guide plate is tightly attached to the inner surface of the frame. The light source is adjacent to the light-guide plate.
摘要翻译: 提供了包括框架,导光板和光源的背光模块。 框架具有开口和与第一表面相对的第一表面和第二表面。 开口从框架的第一表面延伸到第二表面,使得开口的内表面连接到第一表面和第二表面。 内表面的至少一部分朝向开口的内部倾斜。 导光板与框架一体化,并且开口的至少一部分填充有导光板。 导光板紧紧地附着在框架的内表面上。 光源与导光板相邻。
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