公开(公告)号：US20030124862A1

公开(公告)日：2003-07-03

申请号：US10331070

申请日：2002-12-27

Applicant: Fujikoshi Machinery Corp.

Inventor： Noriko Miyairi ,  Yasuo Inada ,  Tsuyoshi Hasegawa ,  Yuji Terashima ,  Kenji Sakai ,  Tadahiro Kitamura ,  Takahiro Umeda

IPC: H01L021/302 ,  H01L021/461

CPC classification number: B24B37/30 ,  C09G1/02 ,  H01L21/3212 ,  H05K3/26 ,  H05K3/383 ,  H05K3/4644 ,  H05K2203/025 ,  H05K2203/121

Abstract: The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.

Abstract translation: 抛光基板的铜层的方法能够提高原料去除率等。该方法包括以下步骤：将基板供给到具有面向抛光垫的铜层的抛光板的抛光垫上; 用衬垫将衬底用衬垫压入抛光垫上; 相对于抛光板相对地旋转压头，同时将抛光浆料供应到抛光垫上。 衬垫由Asker C硬度为75-95且压缩率为10％以下的材料制成。 抛光浆料包括用于螯合铜的螯合剂，用于蚀刻铜层表面的蚀刻剂，用于氧化铜层表面的氧化剂和水。