公开(公告)号：US10668593B2

公开(公告)日：2020-06-02

申请号：US15834983

申请日：2017-12-07

Applicant: Fujikoshi Machinery Corp.

Inventor： Masayuki Tsukada ,  Kazutaka Shibuya ,  Takayuki Fuse

IPC: B24B37/10 ,  B24B37/30 ,  B24B37/32 ,  B24B37/005 ,  B24B37/04 ,  H01L21/304

Abstract: The polishing head comprises: a head main body part; a carrier being connected to the head main body part; a pressure chamber; a fluid supplying section; a linear motion guide having an outer cylindrical body and a spline shaft, which is provided in the outer cylindrical body and capable of moving in an axial direction thereof, and which is prohibited to rotate with respect to the outer cylindrical body so as to transmit a rotational force to the spline shaft through the outer cylindrical body; and a rotation transmitting plate being provided between a lower end of the spline shaft and an upper face of the carrier, the rotation transmitting plate being capable of tiltably supporting the carrier and transmitting a rotational force of the spline shaft to the carrier.

公开(公告)号：US09017146B2

公开(公告)日：2015-04-28

申请号：US14096226

申请日：2013-12-04

Applicant: Fujikoshi Machinery Corp. ,  National Institute of Advanced Industrial Science and Technology

Inventor： Yoshio Nakamura ,  Yoshio Otsuka ,  Takashi Okubo ,  Kazutaka Shibuya ,  Takayuki Fuse ,  Shiro Hara ,  Sommawan Khumpuang ,  Shinichi Ikeda

IPC: B24B37/34 ,  B24B7/22 ,  B24B37/16 ,  B24B53/017 ,  B24B37/10 ,  B24B37/26 ,  B24B37/30

CPC classification number: B24B7/228 ,  B24B37/105 ,  B24B37/16 ,  B24B37/26 ,  B24B37/30 ,  B24B37/345 ,  B24B53/017

Abstract: The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.

Abstract translation: 晶片抛光装置包括抛光板，能够保持晶片的抛光头和浆料供应部分。 抛光板包括：多个同心抛光区，每个同心抛光区具有用于抛光晶片的规定宽度，并且其中每个抛光区附着有抛光布; 以及用于在抛光区之间形成的用于排出浆料的槽。 清洗抛光头的清洁部分或清洁抛光晶片的晶片清洁部分设置在抛光板的中心部分并位于最内侧抛光区的内侧。