公开(公告)号：US20070072425A1

公开(公告)日：2007-03-29

申请号：US10574603

申请日：2004-10-06

申请人： Fumiaki Kikui ,  Akio Morishita ,  Masato Yasuoka

发明人： Fumiaki Kikui ,  Akio Morishita ,  Masato Yasuoka

IPC分类号： H01L21/461 ,  H01L21/302 ,  H01L21/4763 ,  H01L29/94 ,  H01L27/108 ,  H01L29/76 ,  H01L31/119

CPC分类号： H05K1/056 ,  H05K1/053 ,  H05K2201/0209 ,  H05K2201/0248

摘要： A substrate according to the present invention includes a metal plate, and an insulating film, which is provided on the surface of the metal plate and which includes needle alumina particles and granular particles. The substrate of the present invention has excellent insulating property and can be manufactured on an industrial basis with acceptable efficiency.

摘要翻译： 根据本发明的基板包括金属板和绝缘膜，其设置在金属板的表面上并且包括针状氧化铝颗粒和颗粒状颗粒。 本发明的基板具有优异的绝缘性能，可以在工业上以可接受的效率制造。