Thermal interface materials and methods for their preparation and use
    4.
    发明授权
    Thermal interface materials and methods for their preparation and use 失效
    热界面材料及其制备和使用方法

    公开(公告)号:US08440312B2

    公开(公告)日:2013-05-14

    申请号:US13144096

    申请日:2009-12-01

    IPC分类号: B32B9/04 C08L83/04

    摘要: A curable composition contains (A) a polyorganosiloxane base polymer having an average per molecule of at least two aliphatically unsaturated organic groups, optionally (B) a crosslinker having an average per molecule of at least two silicon bonded hydrogen atoms, (C) a catalyst, (D) a thermally conductive filler, and (E) an organic plasticizer. The composition can cure to form a thermally conductive silicone gel or rubber. The thermally conductive silicone rubber is useful as a thermal interface material, in both TIM1 and TIM2 applications. The curable composition may be wet dispensed and then cured in situ in an (opto)electronic device, or the curable composition may be cured to form a pad with or without a support before installation in an (opto)electronic device.

    摘要翻译: 可固化组合物包含(A)每分子具有至少两个脂族不饱和有机基团的平均分子的聚有机硅氧烷基聚合物,任选地(B)每分子具有至少两个硅键合氢原子的平均值的交联剂,(C)催化剂 ,(D)导热填料,(E)有机增塑剂。 组合物可以固化以形成导热硅胶或橡胶。 导热硅橡胶在TIM1和TIM2应用中都可用作热界面材料。 可固化组合物可以被湿式分配,然后在(光)电子器件中原位固化,或者在安装在(光)电子器件中之前,可固化组合物可固化以形成具有或不具有支持物的垫。