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公开(公告)号：US20210162460A1
公开(公告)日：2021-06-03
申请号：US16700903
申请日：2019-12-02
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
摘要： Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array is fabricated by forming an interdigitated structure from a first comb structure with a first sub-element and a second comb structure with a second sub-element. The interdigitated structure is coupled to a base package, a matching layer, and a backing layer to form a plurality of multi-frequency transducers.
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公开(公告)号：US11883846B2
公开(公告)日：2024-01-30
申请号：US16441254
申请日：2019-06-14
发明人： Jason Barrett , Flavien Daloz , Jessica Abraham
IPC分类号： B06B1/06 , H10N30/06 , H10N30/20 , H10N30/088 , A61B8/00
CPC分类号： B06B1/0622 , H10N30/06 , H10N30/088 , H10N30/20 , A61B8/4483
摘要： A method for making ultrasound transducers and ultrasound probes includes providing a piezoelectric layer having a first surface and a second surface, where the second surface is on an opposite side of the piezoelectric layer from the first surface. The method includes fabricating a plurality of conductive through vias extending from the first surface to the second surface of the piezoelectric layer, where fabricating the plurality of conductive through vias comprises cutting a plurality of trenches through the piezoelectric layer and filling each of the plurality of trenches with a conductive material. The method includes cutting the piezoelectric layer into a plurality of transducer units after fabricating the plurality of conductive through vias and cutting each of the transducer units into a plurality of transducer elements.
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公开(公告)号：US11819880B2
公开(公告)日：2023-11-21
申请号：US16700916
申请日：2019-12-02
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
CPC分类号： B06B1/0269 , A61B8/4488 , B06B1/0607 , B06B1/0614 , H10N30/03 , B06B2201/76 , H10N30/20
摘要： Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array includes an element formed of one or more sub-elements, at least one sub-element having a different resonance frequency. A frequency range of the transducer array may thereby be broadened.
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公开(公告)号：US20230264228A1
公开(公告)日：2023-08-24
申请号：US18306895
申请日：2023-04-25
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
CPC分类号： B06B1/0269 , A61B8/4488 , B06B1/0607 , B06B1/0614 , H10N30/03 , B06B2201/76 , H10N30/20
摘要： Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array includes an element formed of one or more sub-elements, at least one sub-element having a different resonance frequency. A frequency range of the transducer array may thereby be broadened.
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公开(公告)号：US20210162461A1
公开(公告)日：2021-06-03
申请号：US16700916
申请日：2019-12-02
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
摘要： Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array includes an element formed of one or more sub-elements, at least one sub-element having a different resonance frequency. A frequency range of the transducer array may thereby be broadened.
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公开(公告)号：US20210162459A1
公开(公告)日：2021-06-03
申请号：US16700886
申请日：2019-12-02
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
摘要： Various methods and systems are provided for a multi-frequency transducer array. In one example, ground recovery in the transducer array is enabled by configuring an acoustic stack of the transducer array with an interdigitated structure, a top layer coupled to a front side of the interdigitated structure, and a bottom layer coupled to a back side of the interdigitated structure, where the top layer and the bottom is electrically continuous with the interdigitated structure.
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公开(公告)号：US12030083B2
公开(公告)日：2024-07-09
申请号：US16700886
申请日：2019-12-02
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
CPC分类号： B06B1/0269 , A61B8/4488 , B06B1/0611 , B06B2201/76 , H10N30/20
摘要： Various methods and systems are provided for a multi-frequency transducer array. In one example, ground recovery in the transducer array is enabled by configuring an acoustic stack of the transducer array with an interdigitated structure, a top layer coupled to a front side of the interdigitated structure, and a bottom layer coupled to a back side of the interdigitated structure, where the top layer and the bottom is electrically continuous with the interdigitated structure.
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公开(公告)号：US12005476B2
公开(公告)日：2024-06-11
申请号：US18306895
申请日：2023-04-25
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
CPC分类号： B06B1/0269 , A61B8/4488 , B06B1/0607 , B06B1/0614 , H10N30/03 , B06B2201/76 , H10N30/20
摘要： Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array includes an element formed of one or more sub-elements, at least one sub-element having a different resonance frequency. A frequency range of the transducer array may thereby be broadened.
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公开(公告)号：US11701688B2
公开(公告)日：2023-07-18
申请号：US16700903
申请日：2019-12-02
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
CPC分类号： B06B1/0269 , A61B8/4494 , B06B1/0607 , B06B1/0614 , H10N30/03 , A61B8/4488 , B06B2201/76 , H10N30/20
摘要： Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array is fabricated by forming an interdigitated structure from a first comb structure with a first sub-element and a second comb structure with a second sub-element. The interdigitated structure is coupled to a base package, a matching layer, and a backing layer to form a plurality of multi-frequency transducers.
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公开(公告)号：US20230191455A1
公开(公告)日：2023-06-22
申请号：US18170349
申请日：2023-02-16
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
CPC分类号： B06B1/0269 , A61B8/4494 , B06B1/0607 , B06B1/0614 , H10N30/03 , A61B8/4488 , B06B2201/76 , H10N30/20
摘要： An example of a method for a multi-frequency transducer array can include forming a first comb structure with a first sub-element having a first resonance frequency, forming a second comb structure, complementary in geometry to the first comb structure with a second sub-element having a second resonance frequency, combining the first and second comb structures to form an interdigitated structure, forming a third acoustic stack by coupling the interdigitated structure to a base package, and coupling the third acoustic stack to a matching layer block and a backing layer block to form a plurality of multi-frequency transducers.
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