公开(公告)号：US12172189B2

公开(公告)日：2024-12-24

申请号：US17119737

申请日：2020-12-11

Applicant: eXo Imaging, Inc.

Inventor： Brian Bircumshaw ,  Sandeep Akkaraju

IPC: B06B1/00 ,  B06B1/06 ,  G01S7/52 ,  G01S15/89 ,  H10N30/073 ,  H10N30/088 ,  H10N30/80 ,  H10N30/853 ,  H10N30/87

Abstract: The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.

公开(公告)号：US20240238843A1

公开(公告)日：2024-07-18

申请号：US18155004

申请日：2023-01-16

Applicant: GE Precision Healthcare LLC

Inventor： Alexis Hubert ,  Giandonato Stallone ,  Edouard Da Cruz ,  Manon Chateauvieux ,  Solenne Drewniak

IPC: B06B1/06 ,  H10N30/086 ,  H10N30/088

CPC classification number: B06B1/0622 ,  H10N30/086 ,  H10N30/088 ,  A61B8/4488 ,  B06B2201/76

Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array includes a plurality of elements formed of two or more piezoelectric materials, the two or more piezoelectric materials having different resonance frequencies. Furthermore, the two or more piezoelectric materials may be oriented independent of a dicing pattern of the transducer array, the dicing pattern defining the plurality of elements.

公开(公告)号：US11942276B2

公开(公告)日：2024-03-26

申请号：US17168757

申请日：2021-02-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Daizo Ito

IPC: H01L41/047 ,  H01C7/00 ,  H01C17/28 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H10N30/067 ,  H10N30/088 ,  H10N30/50 ,  H10N30/87

CPC classification number: H01G4/30 ,  H01C7/008 ,  H01C17/28 ,  H01G4/012 ,  H01G4/12 ,  H10N30/067 ,  H10N30/088 ,  H10N30/50 ,  H10N30/87

Abstract: Even with the occurrence of misalignment of inner electrodes in a ceramic collective board, a multilayer electronic component is made in which inner electrodes are disposed at suitable positions. Disclosed herein are descriptions of a first-stage ceramic collective board and a second-stage ceramic collective board used for manufacturing a multilayer electronic component. The present disclosure further describes a manufacturing method for the second-stage ceramic collective board and a manufacturing method for a multilayer electronic component.

公开(公告)号：US20240022186A1

公开(公告)日：2024-01-18

申请号：US18250373

申请日：2021-10-14

Applicant: Université de Franche-Comté ,  Ecole Nationale Superieure de Mecanique et Des Microtechniques-Ensmm

Inventor： Ausrine BARTASYTE ,  Samuel MARGUERON ,  Ludovic GAUTHIER-MANUEL ,  Giacomo CLEMENTI ,  Merieme OUHABAZ ,  Florent BASSIGNOT

IPC: H02N2/18 ,  H02N2/00 ,  H10N30/853 ,  H10N30/30 ,  H10N30/073 ,  H10N30/086 ,  H10N30/088

CPC classification number: H02N2/188 ,  H02N2/22 ,  H10N30/8542 ,  H10N30/306 ,  H10N30/073 ,  H10N30/086 ,  H10N30/088

Abstract: The invention relates to a piezoelectric device comprising flexible single crystalline piezoelectric LiNbO3 and/or LiTaO3 films integrated on flexible substrate and methods for producing the same. More specifically, the invention relates to a flexible piezoelectric device for energy harvesting. The a Flexible piezoelectric device comprises a flexible substrate layer which comprises an upper face and a lower face, and at least one LiNbO3 and/or LiTaO3 film, called LNT film bonded to one of the faces of the flexible substrate layer, wherein thickness tf of said at least one LNT film is chosen between a use range of 5 to 50 micrometers (μm).

公开(公告)号：US11759171B2

公开(公告)日：2023-09-19

申请号：US17386171

申请日：2021-07-27

Applicant: CANON MEDICAL SYSTEMS CORPORATION

Inventor： Takashi Takeuchi ,  Shohei Sasaki ,  Hiroyuki Shikata

IPC: A61B8/00 ,  B06B1/06 ,  H10N30/088

CPC classification number: A61B8/4444 ,  A61B8/4494 ,  B06B1/0622 ,  H10N30/088

Abstract: An ultrasonic probe of an embodiment includes a vibrator, an acoustic matching layer, and a back layer. The vibrator includes a plurality of vibrating elements arranged in a first direction. The acoustic matching layer is formed on a living body side of the vibrator. The back layer is formed on a back side of the vibrator opposite the living body side. The plurality of vibrating elements are formed by being divided by first grooves passing through the vibrator and the back layer. Second grooves passing through the vibrating elements and penetrating into the back layer are provided in each of the vibrating elements. A penetration depth of the second grooves in a second direction in the back layer is less than a width of the second grooves in the first direction in the vibrating elements.

公开(公告)号：US20240164754A1

公开(公告)日：2024-05-23

申请号：US18424618

申请日：2024-01-26

Applicant: FUJIFILM SONOSITE, INC.

Inventor： Wei Li ,  Gregg Frey ,  Simon Hsu

IPC: A61B8/00 ,  B06B1/06 ,  G01N29/24 ,  H10N30/072 ,  H10N30/088 ,  H10N30/20

CPC classification number: A61B8/4494 ,  B06B1/0622 ,  B06B1/0644 ,  B06B1/067 ,  G01N29/2406 ,  G01N29/2437 ,  H10N30/072 ,  H10N30/088 ,  H10N30/206 ,  A61B8/4444 ,  G01N2291/0231

Abstract: Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.

公开(公告)号：US20240072758A1

公开(公告)日：2024-02-29

申请号：US18464898

申请日：2023-09-11

Applicant: Skyworks Solutions, Inc.

Inventor： Atsushi Takano ,  Takeshi Furusawa ,  Mitsuhiro Furukawa

IPC: H03H9/02 ,  H03H3/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/205 ,  H03H9/56 ,  H10N30/088

CPC classification number: H03H9/02133 ,  H03H3/02 ,  H03H9/02102 ,  H03H9/02125 ,  H03H9/0514 ,  H03H9/105 ,  H03H9/205 ,  H03H9/566 ,  H10N30/088 ,  H04B1/3827

Abstract: Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

公开(公告)号：US20240016061A1

公开(公告)日：2024-01-11

申请号：US18220295

申请日：2023-07-11

Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, DANKOOK UNIVERSITY

Inventor： Ji-Hyeon Song ,  Yujun Song

IPC: H10N30/30 ,  H10N30/045 ,  H10N30/072 ,  H10N30/088 ,  G06F3/041

CPC classification number: H10N30/30 ,  H10N30/045 ,  H10N30/072 ,  H10N30/088 ,  G06F3/0414 ,  G06F3/04164

Abstract: Disclosed herein are a piezoelectric element, a method of manufacturing the piezoelectric element, a touchpad including the piezoelectric element, and a method of operating the touchpad, wherein the piezoelectric element has a shape of an N-hedron and includes N polygonal unit piezoelectric films forming N faces of the N-hedron, and the touchpad includes: a first piezoelectric element having a shape of an N-hedron; a pad body having a first installation groove detachably supporting the first piezoelectric element; and a signal processer receiving and processing a first signal generated by the first piezoelectric element in response to a first external force, wherein N unit signals are generated by N unit piezoelectric films forming N faces of the first piezoelectric element in response to one external force.

公开(公告)号：US11845275B2

公开(公告)日：2023-12-19

申请号：US17537940

申请日：2021-11-30

Applicant: TOSHIBA TEC KABUSHIKI KAISHA

Inventor： Masashi Shimosato ,  Taiki Goto ,  Akio Hamada

IPC: B41J2/14 ,  H10N30/50 ,  H10N30/057 ,  H10N30/063 ,  H10N30/088 ,  H10N30/87 ,  H10N30/20 ,  H10N30/853

CPC classification number: B41J2/14201 ,  H10N30/057 ,  H10N30/063 ,  H10N30/088 ,  H10N30/2047 ,  H10N30/50 ,  H10N30/8542 ,  H10N30/8554 ,  H10N30/871 ,  H10N30/872 ,  H10N30/875

Abstract: According to one embodiment, a liquid discharge head includes a flexible printed circuit (FPC) connected to piezoelectric elements. The FPC has a first end in the first direction. A wiring layer of the FPC has a first region at the first end and a cover layer covering on a second region. The piezoelectric elements are spaced from each other in a second direction and each has a first electrode on a side surface facing towards the FPC. The first side has a joint surface facing the first region of the wiring layer. The first electrode is electrically connected to the wiring layer at the joint surface. The side surface includes a step portion that is recessed from the joint surface. A portion of the cover layer protrudes into a space adjacent to the step portion.

公开(公告)号：US20230329673A1

公开(公告)日：2023-10-19

申请号：US18211811

申请日：2023-06-20

Applicant: OLYMPUS MEDICAL SYSTEMS CORP.

Inventor： Satoshi YOSHIDA

IPC: A61B8/00 ,  A61B8/12 ,  B06B1/06 ,  H10N30/088

CPC classification number: A61B8/4483 ,  A61B8/12 ,  B06B1/067 ,  B06B1/0681 ,  H10N30/088 ,  B06B2201/76

Abstract: An ultrasound probe includes: an ultrasound transducer that includes a piezoelectric element configured to transmit and receive ultrasound waves to and from a subject; and an adjustment layer that is laminated on the piezoelectric element, the adjustment layer being provided with a cut surface that is cut by a blade configured to cut the piezoelectric element, the adjustment layer including an adjustment material configured to improve cutting performance of the blade.