公开(公告)号：US3623649A

公开(公告)日：1971-11-30

申请号：US3623649D

申请日：1969-06-09

Applicant: GEN MOTORS CORP

Inventor： KEISLING WAYNE H

IPC: H01L21/00 ,  H01L21/48 ,  H01L21/607 ,  B23K1/20

CPC classification number: H01L24/85 ,  H01L21/4853 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10S228/904 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753

Abstract: A bonding tool and method is disclosed for bonding the ends of a threadlike wire lead to two spaced-apart regions of a semiconductive device or other electronic article. One form of this invention includes a bonding tool having a tip for use with a reel of lead wire. The tip has an outwardly extending tapered groove on its working surface for producing an elongated wedgeshaped bond with the thinnest section of the wedge at the end of the bond adjacent to the reel. The unbonded wire adjacent the thinnest wedge section, extending from the source reel, is readily detached from the bonded portion with a light tug.