公开(公告)号：US20150173243A1

公开(公告)日：2015-06-18

申请号：US14106207

申请日：2013-12-13

Applicant: General Electric Company

Inventor： Shakti Singh Chauhan ,  Hendrik Pieter Jacobus de Bock ,  Graham Charles Kirk ,  Stanton Earl Weaver, JR. ,  David Shannon Slaton ,  Tao Deng ,  Pramod Chamarthy

IPC: H05K7/20 ,  F28D15/04

CPC classification number: H05K7/20336 ,  F28D15/0275 ,  F28D15/04 ,  H01L21/4882 ,  H01L23/36 ,  H01L23/40 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat exchange assembly for dissipating heat from a hot component of a circuit card is disclosed. The heat exchange assembly includes a support structure having a first support end, a second support end, and a support portion extending between the first support end and the second support end. The support structure further includes a plurality of first projections protruding from a portion of a surface of the support structure, corresponding to the support portion. Further, the heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is coupled to a surface of the support structure.

Abstract translation: 公开了一种用于从电路卡的热部件散热的热交换组件。 热交换组件包括支撑结构，其具有第一支撑端，第二支撑端和在第一支撑端和第二支撑端之间延伸的支撑部分。 支撑结构还包括从支撑结构的表面的一部分突出的多个第一突起，其对应于支撑部分。 此外，热交换组件包括具有设置在壳体内的壳体和芯的蒸气室。 蒸气室耦合到支撑结构的表面。

公开(公告)号：US10667429B2

公开(公告)日：2020-05-26

申请号：US15699713

申请日：2017-09-08

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Shakti Singh Chauhan ,  Hendrik Pieter Jacobus De Bock ,  Graham Charles Kirk ,  Stanton Earl Weaver, Jr. ,  David Shannon Slaton ,  Tao Deng ,  Pramod Chamarthy

IPC: H05K7/20 ,  F28D15/02 ,  F28D15/04 ,  H01L23/40 ,  H01L23/427 ,  H01L21/48 ,  H01L23/36

Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.