公开(公告)号：US20160095199A1

公开(公告)日：2016-03-31

申请号：US14500530

申请日：2014-09-29

Applicant: General Electric Company

Inventor： Shakti Singh Chauhan ,  Stuart Connolly ,  Binoy Milan Shah ,  Brian Hoden ,  Joo Han Kim

IPC: H05K1/02 ,  H05K3/36 ,  H05K3/30 ,  H05K7/20 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H05K1/181 ,  H05K3/30 ,  H05K3/368 ,  H05K7/1461 ,  H05K7/20672

Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Abstract translation: 提供电路卡组件。 组件包括第一印刷电路板，在预定位置安装在第一印刷电路板上的至少一个电子元件，耦合到第一印刷电路板的框架和耦合到框架的传热组件。 传热组件包括在第一印刷电路板的至少一部分上延伸的第一板，耦合到第一板的热管和位于至少一个电子部件和热管之间的导热部件。 导热构件基于所述至少一个电子部件的预定位置被选择性地安装在沿着第一板的预定位置处。

公开(公告)号：US09184124B2

公开(公告)日：2015-11-10

申请号：US14547667

申请日：2014-11-19

Applicant: General Electric Company

Inventor： Shakti Singh Chauhan ,  Arun Virupaksha Gowda ,  Paul Alan McConnelee

IPC: H01L21/70 ,  H01L23/498 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L25/07 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/3178 ,  H01L23/3735 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L24/95 ,  H01L25/072 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2224/92144 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A surface mount packaging structure that yields improved thermo-mechanical reliability and more robust second-level package interconnections is disclosed. The surface mount packaging structure includes a sub-module having a dielectric layer, semiconductor devices attached to the dielectric layer, a first level metal interconnect structure electrically coupled to the semiconductor devices, and a second level I/O connection electrically coupled to the first level interconnect and formed on the dielectric layer on a side opposite the semiconductor devices, with the second level I/O connection configured to connect the sub-module to an external circuit. The semiconductor devices of the sub-module are attached to the first surface of a multi-layer substrate structure, with a dielectric material positioned between the dielectric layer and the multi-layer substrate structure to fill in gaps in the surface-mount structure and provide additional structural integrity thereto.

公开(公告)号：US20150255418A1

公开(公告)日：2015-09-10

申请号：US14195930

申请日：2014-03-04

Applicant: General Electric Company

Inventor： Arun Virupaksha Gowda ,  Paul Alan McConnelee ,  Shakti Singh Chauhan

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L25/10 ,  H01L23/48

CPC classification number: H01L24/32 ,  H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/43 ,  H01L24/45 ,  H01L24/46 ,  H01L24/82 ,  H01L24/83 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05599 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2518 ,  H01L2224/2711 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32501 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/46 ,  H01L2224/80365 ,  H01L2224/85399 ,  H01L2224/92144 ,  H01L2225/1052 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/13091 ,  H01L2924/1433 ,  H01L2924/207 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/183 ,  H05K1/185 ,  H05K3/301 ,  H05K3/305 ,  H05K3/306 ,  H05K3/366 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/09845 ,  H05K2203/302 ,  Y02P70/613

Abstract: A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

Abstract translation: 封装结构包括第一电介质层，附着到第一电介质层的半导体器件，以及施加到第一电介质层以将半导体器件嵌入其中的嵌入材料，所述嵌入材料包括一个或多个附加电介质层 。 通过第一介电层形成通孔至至少一个半导体器件，其中形成在通孔中的金属互连形成与半导体器件的电互连。 输入/输出（I / O）连接位于封装结构的一个或多个向外表面上的一端，以提供与外部电路的第二级连接。 封装结构与外部电路上的连接器相互连接，以将封装垂直于外部电路安装，其中I / O连接电连接到连接器以形成到外部电路的第二级连接。

公开(公告)号：US20150173243A1

公开(公告)日：2015-06-18

申请号：US14106207

申请日：2013-12-13

Applicant: General Electric Company

Inventor： Shakti Singh Chauhan ,  Hendrik Pieter Jacobus de Bock ,  Graham Charles Kirk ,  Stanton Earl Weaver, JR. ,  David Shannon Slaton ,  Tao Deng ,  Pramod Chamarthy

IPC: H05K7/20 ,  F28D15/04

CPC classification number: H05K7/20336 ,  F28D15/0275 ,  F28D15/04 ,  H01L21/4882 ,  H01L23/36 ,  H01L23/40 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat exchange assembly for dissipating heat from a hot component of a circuit card is disclosed. The heat exchange assembly includes a support structure having a first support end, a second support end, and a support portion extending between the first support end and the second support end. The support structure further includes a plurality of first projections protruding from a portion of a surface of the support structure, corresponding to the support portion. Further, the heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is coupled to a surface of the support structure.

Abstract translation: 公开了一种用于从电路卡的热部件散热的热交换组件。 热交换组件包括支撑结构，其具有第一支撑端，第二支撑端和在第一支撑端和第二支撑端之间延伸的支撑部分。 支撑结构还包括从支撑结构的表面的一部分突出的多个第一突起，其对应于支撑部分。 此外，热交换组件包括具有设置在壳体内的壳体和芯的蒸气室。 蒸气室耦合到支撑结构的表面。

公开(公告)号：US10269688B2

公开(公告)日：2019-04-23

申请号：US13897685

申请日：2013-05-20

Applicant: General Electric Company

Inventor： Arun Virupaksha Gowda ,  Paul Alan McConnelee ,  Shakti Singh Chauhan

IPC: H01L23/34 ,  H01L23/495 ,  H01L23/433 ,  H01L23/538 ,  H01L23/00

Abstract: A semiconductor device module includes a dielectric layer, a semiconductor device having a first surface coupled to the dielectric layer, and a conducting shim having a first surface coupled to the dielectric layer. The semiconductor device also includes an electrically conductive heatspreader having a first surface coupled to a second surface of the semiconductor device and a second surface of the conducting shim. A metallization layer is coupled to the first surface of the semiconductor device and the first surface of the conducting shim. The metallization layer extends through the dielectric layer and is electrically connected to the second surface of the semiconductor device by way of the conducting shim and the heatspreader.

公开(公告)号：US10186477B2

公开(公告)日：2019-01-22

申请号：US15363237

申请日：2016-11-29

Applicant: General Electric Company

Inventor： Arun Virupaksha Gowda ,  Paul Alan McConnelee ,  Shakti Singh Chauhan

IPC: H01L23/495 ,  H01L23/433 ,  H01L23/538 ,  H01L23/00

Abstract: A semiconductor device module includes a dielectric layer, a semiconductor device having a first surface coupled to the dielectric layer, and a conducting shim having a first surface coupled to the dielectric layer. The semiconductor device also includes an electrically conductive heatspreader having a first surface coupled to a second surface of the semiconductor device and a second surface of the conducting shim. A metallization layer is coupled to the first surface of the semiconductor device and the first surface of the conducting shim. The metallization layer extends through the dielectric layer and is electrically connected to the second surface of the semiconductor device by way of the conducting shim and the heatspreader.

公开(公告)号：US10070531B2

公开(公告)日：2018-09-04

申请号：US14579569

申请日：2014-12-22

Applicant: General Electric Company

Inventor： Arun Virupaksha Gowda ,  Donald Paul Cunningham ,  Shakti Singh Chauhan

IPC: H01L33/00 ,  H05K1/18 ,  H01L25/075 ,  H01L33/62 ,  H01L27/15 ,  H01L33/60 ,  H01L33/64 ,  H05K1/02

Abstract: A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device is provided that includes a heatsink and an array of LES chips mounted on the heatsink and electrically connected thereto, with each LES chip comprising connection pads and a light emitting area configured to emit light therefrom responsive to a received electrical power. The LES device also includes a flexible interconnect structure positioned on and electrically connected to each LES chip to provide for control LES operation of the array of LES chips, with the flexible interconnect structure further including a flexible dielectric film configured to conform to a shape of the heatsink and a metal interconnect structure formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips.

公开(公告)号：US09806051B2

公开(公告)日：2017-10-31

申请号：US14195930

申请日：2014-03-04

Applicant: General Electric Company

Inventor： Arun Virupaksha Gowda ,  Paul Alan McConnelee ,  Shakti Singh Chauhan

IPC: H01L23/02 ,  H01L23/00 ,  H01L23/34 ,  H01L23/538 ,  H05K3/30 ,  H05K3/46 ,  H01L23/367 ,  H01L23/373 ,  H01L23/48 ,  H01L25/10 ,  H01L23/42 ,  H01L23/433 ,  H05K1/18 ,  H05K1/02 ,  H05K3/36

CPC classification number: H01L24/32 ,  H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/43 ,  H01L24/45 ,  H01L24/46 ,  H01L24/82 ,  H01L24/83 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05599 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2518 ,  H01L2224/2711 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32501 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/46 ,  H01L2224/80365 ,  H01L2224/85399 ,  H01L2224/92144 ,  H01L2225/1052 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/13091 ,  H01L2924/1433 ,  H01L2924/207 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/183 ,  H05K1/185 ,  H05K3/301 ,  H05K3/305 ,  H05K3/306 ,  H05K3/366 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/09845 ,  H05K2203/302 ,  Y02P70/613

Abstract: A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

公开(公告)号：US09704788B2

公开(公告)日：2017-07-11

申请号：US14665735

申请日：2015-03-23

Applicant: General Electric Company

Inventor： Arun Virupaksha Gowda ,  Paul Alan McConnelee ,  Shakti Singh Chauhan

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/433 ,  H01L23/538 ,  H01L23/00 ,  H01L23/367 ,  H01L25/065

CPC classification number: H01L23/49575 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49579 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00

Abstract: A power overlay (POL) structure includes a POL sub-module. The POL sub-module includes a dielectric layer and a semiconductor device having a top surface attached to the dielectric layer. The top surface of the semiconductor device has at least one contact pad formed thereon. The POL sub-module also includes a metal interconnect structure that extends through the dielectric layer and is electrically coupled to the at least one contact pad of the semiconductor device. A conducting shim is coupled to a bottom surface of the semiconductor device and a first side of a thermal interface is coupled to the conducting shim. A heat sink is coupled to a second side of the electrically insulating thermal interface.

公开(公告)号：US09615486B2

公开(公告)日：2017-04-04

申请号：US14225461

申请日：2014-03-26

Applicant: General Electric Company

Inventor： Hendrik Pieter Jacobus De Bock ,  Jay Todd Labhart ,  Shakti Singh Chauhan ,  Graham Charles Kirk ,  Joo Han Kim

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  H01L23/42 ,  H01L23/427 ,  H01L23/433

CPC classification number: H05K7/2039 ,  H01L23/42 ,  H01L23/427 ,  H01L23/4275 ,  H01L23/433 ,  H01L2924/15311

Abstract: A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.