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公开(公告)号：US20150173243A1
公开(公告)日：2015-06-18
申请号：US14106207
申请日：2013-12-13
Applicant: General Electric Company
Inventor： Shakti Singh Chauhan , Hendrik Pieter Jacobus de Bock , Graham Charles Kirk , Stanton Earl Weaver, JR. , David Shannon Slaton , Tao Deng , Pramod Chamarthy
CPC classification number: H05K7/20336 , F28D15/0275 , F28D15/04 , H01L21/4882 , H01L23/36 , H01L23/40 , H01L23/427 , H01L2924/0002 , H01L2924/00
Abstract: A heat exchange assembly for dissipating heat from a hot component of a circuit card is disclosed. The heat exchange assembly includes a support structure having a first support end, a second support end, and a support portion extending between the first support end and the second support end. The support structure further includes a plurality of first projections protruding from a portion of a surface of the support structure, corresponding to the support portion. Further, the heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is coupled to a surface of the support structure.
Abstract translation: 公开了一种用于从电路卡的热部件散热的热交换组件。 热交换组件包括支撑结构，其具有第一支撑端，第二支撑端和在第一支撑端和第二支撑端之间延伸的支撑部分。 支撑结构还包括从支撑结构的表面的一部分突出的多个第一突起，其对应于支撑部分。 此外，热交换组件包括具有设置在壳体内的壳体和芯的蒸气室。 蒸气室耦合到支撑结构的表面。
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公开(公告)号：US20150181763A1
公开(公告)日：2015-06-25
申请号：US14135678
申请日：2013-12-20
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, JR. , Tao Deng , Jay Todd Labhart , Pramod Chamarthy , Shakti Singh Chauhan , Graham Charles Kirk , Brian Patrick Hoden
CPC classification number: B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0266 , F28D15/0275 , H05K7/20681 , H05K9/0062 , Y10T29/49826
Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Abstract translation: 提供电子底盘。 电子机箱包括限定内部空间的多个面板。 所述多个面板中的一个面板具有具有内表面和外表面的复合区段。 电子底盘还包括导电热路径，其从复合段的内表面延伸穿过面板到复合段的外表面。
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公开(公告)号：US20150168087A1
公开(公告)日：2015-06-18
申请号：US14103868
申请日：2013-12-12
Applicant: General Electric Company
Inventor： Joo Han Kim , Graham Charles Kirk , Jay Todd Labhart , Binoy Milan Shah , Yogen Vishwas Utturkar , Pramod Charmarthy , Tao Deng
CPC classification number: H05K7/20454 , C09K5/063 , F28F21/08 , H01L23/4275 , H01L2924/0002 , H05K1/0203 , H05K7/20672 , H01L2924/00
Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.
Abstract translation: 提供了具有金属基泡沫和易熔金属基合金的可重复使用的相变热界面结构。 在可熔金属基合金的固相中，可熔金属基合金至少设置在金属基泡沫的一部分中。 此外，在可熔金属基合金的液相中，可熔融金属基合金至少设置在金属基泡沫的一个或多个外表面的一部分上。
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公开(公告)号：US20160021788A1
公开(公告)日：2016-01-21
申请号：US14676241
申请日：2015-04-01
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Shakti Singh Chauhan , James Neil Johnson , Brian Patrick Hoden , Graham Charles Kirk
CPC classification number: H05K7/20427 , B23P15/26 , H01L23/3675 , H01L23/3732 , H01L23/42 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152
Abstract: An electronic device assembly includes a heat sink coupled to an electronic device to dissipate the heat produced by the electronic device. A heat spreader is coupled between the electronic device and the heat sink to transfer heat from the electronic device to the heat sink. Furthermore, at least one of the electronic device, the heat spreader, and the heat sink is disposed with a disordered carbon coating.
Abstract translation: 电子设备组件包括耦合到电子设备的散热器以散发由电子设备产生的热量。 散热器耦合在电子设备和散热器之间，以将热量从电子设备传递到散热器。 此外，电子设备，散热器和散热器中的至少一个设置有无序的碳涂层。
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公开(公告)号：US20150116940A1
公开(公告)日：2015-04-30
申请号：US14068697
申请日：2013-10-31
Applicant: General Electric Company
Inventor： Joo Han Kim , Hendrik Pieter Jacobus de Bock , Jay Todd Labhart , Shakti Singh Chauhan , Graham Charles Kirk , Stuart Connolly
IPC: H05K1/02
CPC classification number: H05K1/0203 , H05K7/1461 , H05K7/20672 , Y10T29/49002
Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.
Abstract translation: 提供电路卡组件。 电路卡组件包括印刷电路板，安装在印刷电路板上的至少一个电子部件和耦合到印刷电路板的框架，使得电子部件设置在印刷电路板和框架之间。 电路卡组件还包括耦合到框架的传热装置。 传热装置具有至少部分地设置在框架和印刷电路板之间的热管。 电路卡组件还包括将热管朝向电子部件偏置的可枢转支架，以便于冷却电子部件。
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Patent Agency Ranking
公开(公告)号：US20130206363A1
公开(公告)日：2013-08-15
申请号：US13750078
申请日：2013-01-25
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Graham Charles Kirk , Stuart Connolly , Tao Deng , Zeshan Jabar Hussain , Binoy Milan Shah
CPC classification number: F28F27/00 , B23P15/26 , F28D20/02 , F28F7/00 , F28F2013/008 , F28F2255/02 , H01L23/40 , H01L23/4275 , H01L23/4338 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.
Abstract translation: 一种热连接器，其构造成放置在散热器和发热部件之间的散热器的凹部内，并将热量从部件传递到散热器，包括构造成装配在散热器的凹部内的散热器， 弹簧构造成位于散热器和散热器之间并且将散热器朝向和远离散热器偏置，附接到散热器和散热器并且密封凹部的柔性膜以及相变材料， 填充凹部，其中柔性膜包含相变材料，并且允许其响应于散热器朝向或远离散热器的移动而收缩或膨胀。
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公开(公告)号：US10667429B2
公开(公告)日：2020-05-26
申请号：US15699713
申请日：2017-09-08
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Shakti Singh Chauhan , Hendrik Pieter Jacobus De Bock , Graham Charles Kirk , Stanton Earl Weaver, Jr. , David Shannon Slaton , Tao Deng , Pramod Chamarthy
Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.
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公开(公告)号：US09826662B2
公开(公告)日：2017-11-21
申请号：US14103868
申请日：2013-12-12
Applicant: General Electric Company
Inventor： Joo Han Kim , Graham Charles Kirk , Jay Todd Labhart , Binoy Milan Shah , Yogen Vishwas Utturkar , Pramod Charmarthy , Tao Deng
IPC: H05K7/20 , F28F21/08 , C09K5/06 , H01L23/427 , H05K1/02
CPC classification number: H05K7/20454 , C09K5/063 , F28F21/08 , H01L23/4275 , H01L2924/0002 , H05K1/0203 , H05K7/20672 , H01L2924/00
Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.
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公开(公告)号：US09333599B2
公开(公告)日：2016-05-10
申请号：US14135678
申请日：2013-12-20
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, Jr. , Tao Deng , Jay Todd Labhart , Pramod Chamarthy , Shakti Singh Chauhan , Graham Charles Kirk , Brian Patrick Hoden
CPC classification number: B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0266 , F28D15/0275 , H05K7/20681 , H05K9/0062 , Y10T29/49826
Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Abstract translation: 提供电子底盘。 电子机箱包括限定内部空间的多个面板。 所述多个面板中的一个面板具有具有内表面和外表面的复合区段。 电子底盘还包括导电热路径，其从复合段的内表面延伸穿过面板到复合段的外表面。
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公开(公告)号：US09253871B2
公开(公告)日：2016-02-02
申请号：US14068697
申请日：2013-10-31
Applicant: General Electric Company
Inventor： Joo Han Kim , Hendrik Pieter Jacobus de Bock , Jay Todd Labhart , Shakti Singh Chauhan , Graham Charles Kirk , Stuart Connolly
CPC classification number: H05K1/0203 , H05K7/1461 , H05K7/20672 , Y10T29/49002
Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.
Abstract translation: 提供电路卡组件。 电路卡组件包括印刷电路板，安装在印刷电路板上的至少一个电子部件和耦合到印刷电路板的框架，使得电子部件设置在印刷电路板和框架之间。 电路卡组件还包括耦合到框架的传热装置。 传热装置具有至少部分地设置在框架和印刷电路板之间的热管。 电路卡组件还包括将热管朝向电子部件偏置的可枢转支架，以便于冷却电子部件。
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