CAPACITOR AND CONTACT STRUCTURES, AND FORMATION PROCESSES THEREOF
    1.
    发明申请
    CAPACITOR AND CONTACT STRUCTURES, AND FORMATION PROCESSES THEREOF 有权
    电容器和接触结构及其形成过程

    公开(公告)号:US20150364540A1

    公开(公告)日:2015-12-17

    申请号:US14837288

    申请日:2015-08-27

    CPC classification number: H01L28/60 H01L27/10805

    Abstract: Capacitor and contact structures are provided, as well as methods for forming the capacitor and contact structures. The methods include, for instance, providing a layer of conductive material above a conductive structure and above a lower electrode of a capacitor; etching the layer of conductive material to define a conductive material hard mask and an upper electrode of the capacitor, the conductive material hard mask being disposed at least partially above the conductive structure; and forming a first conductive contact structure and a second conductive contact structure, the first conductive contact structure extending through an opening in the conductive material hard mask and conductively contacting the conductive structure, and the second conductive contact structure conductively contacting one of the lower electrode of the capacitor, or the upper electrode of the capacitor.

    Abstract translation: 提供了电容器和接触结构,以及形成电容器和接触结构的方法。 所述方法包括例如在导电结构之上和电容器的下电极之上提供导电材料层; 蚀刻导电材料层以限定导电材料硬掩模和电容器的上电极,导电材料硬掩模至少部分地设置在导电结构之上; 以及形成第一导电接触结构和第二导电接触结构,所述第一导电接触结构延伸穿过所述导电材料硬掩模中的开口并导电地接触所述导电结构,并且所述第二导电接触结构导电地接触所述导电接触结构的下电极之一 电容器或电容器的上电极。

    CAPACITOR AND CONTACT STRUCTURES, AND FORMATION PROCESSES THEREOF
    3.
    发明申请
    CAPACITOR AND CONTACT STRUCTURES, AND FORMATION PROCESSES THEREOF 有权
    电容器和接触结构及其形成过程

    公开(公告)号:US20140098459A1

    公开(公告)日:2014-04-10

    申请号:US13648504

    申请日:2012-10-10

    CPC classification number: H01L28/60 H01L27/10805

    Abstract: Capacitor and contact structures are provided, as well as methods for forming the capacitor and contact structures. The methods include, for instance, providing a layer of conductive material above a conductive structure and above a lower electrode of a capacitor; etching the layer of conductive material to define a conductive material hard mask and an upper electrode of the capacitor, the conductive material hard mask being disposed at least partially above the conductive structure; and forming a first conductive contact structure and a second conductive contact structure, the first conductive contact structure extending through an opening in the conductive material hard mask and conductively contacting the conductive structure, and the second conductive contact structure conductively contacting one of the lower electrode of the capacitor, or the upper electrode of the capacitor.

    Abstract translation: 提供了电容器和接触结构,以及形成电容器和接触结构的方法。 所述方法包括例如在导电结构之上和电容器的下电极之上提供导电材料层; 蚀刻导电材料层以限定导电材料硬掩模和电容器的上电极,导电材料硬掩模至少部分地设置在导电结构之上; 以及形成第一导电接触结构和第二导电接触结构,所述第一导电接触结构延伸穿过所述导电材料硬掩模中的开口并导电地接触所述导电结构,并且所述第二导电接触结构导电地接触所述导电接触结构的下电极之一 电容器或电容器的上电极。

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