公开(公告)号：US09893157B1

公开(公告)日：2018-02-13

申请号：US15401281

申请日：2017-01-09

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Natalie B. Feilchenfeld ,  Michael J. Zierak ,  Max G. Levy ,  BethAnn Lawrence

IPC: H01L29/00 ,  H01L29/40 ,  H01L21/762 ,  H01L23/522 ,  H01L21/768 ,  H01L29/10 ,  H01L23/532 ,  H01L27/12 ,  H01L29/78

CPC classification number: H01L29/407 ,  H01L21/76283 ,  H01L21/76802 ,  H01L23/5226 ,  H01L23/53271 ,  H01L27/1207 ,  H01L29/107 ,  H01L29/1087 ,  H01L29/7824

Abstract: Structures that include contact trenches and isolation trenches, as well as methods for forming structures including contact trenches and isolation trenches. A contact trench is formed that extends through a device layer of a silicon-on-insulator (SOI) substrate to a buried oxide layer of the SOI substrate. An isolation trench is formed that extends through the device layer to the buried oxide layer. An electrical insulator is deposited that fills the contact trench and the first isolation trench. The electrical insulator is removed from the contact trench. After the electrical insulator is removed from the contact trench, an electrical conductor is formed in the contact trench. The electrical contact may be coupled with a doped region in a handle wafer of the SOI substrate.

公开(公告)号：US09324632B2

公开(公告)日：2016-04-26

申请号：US14288852

申请日：2014-05-28

Applicant: GLOBALFOUNDRIES INC.

Inventor： Natalie B. Feilchenfeld ,  BethAnn Lawrence ,  Yun Shi

IPC: H01L21/76 ,  H01L23/48 ,  H01L21/768 ,  H01L21/762 ,  H01L29/06 ,  H01L27/12

CPC classification number: H01L23/535 ,  H01L21/743 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/528 ,  H01L27/1207 ,  H01L29/0649 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of forming a semiconductor structure in a semiconductor-on-insulator (SOI) substrate and semiconductor structure so formed are provided. The SOI substrate includes a semiconductor layer; a bulk semiconductor region underlying the semiconductor layer; and an insulation layer between the two. The method includes substantially simultaneously forming a first opening and a second opening extending from the semiconductor layer to the conductive region; introducing an insulating material to the side walls of the first opening; at least partially filling the first opening with a semiconductor material to provide an ohmic contact trench; and at least partially filling the second opening with an insulating material to form a device isolation trench. Insulating regions, for example, shallow trench isolation (STI) regions, may be formed about the device isolation trench and the ohmic contact trench. Semiconductor structures are also provided. The benefits of combining the features of SOI and STI structures are provided.

Abstract translation: 提供一种在绝缘体上半导体（SOI）衬底和如此形成的半导体结构中形成半导体结构的方法。 SOI衬底包括半导体层; 半导体层下面的体半导体区域; 和两者之间的绝缘层。 该方法基本上同时形成从半导体层延伸到导电区域的第一开口和第二开口; 向所述第一开口的侧壁引入绝缘材料; 至少部分地用半导体材料填充所述第一开口以提供欧姆接触沟槽; 并且用绝缘材料至少部分地填充第二开口以形成器件隔离沟槽。 可以围绕器件隔离沟槽和欧姆接触沟槽形成绝缘区域，例如浅沟槽隔离（STI）区域。 还提供了半导体结构。 提供了结合SOI和STI结构的特征的好处。

公开(公告)号：US09786606B2

公开(公告)日：2017-10-10

申请号：US15066374

申请日：2016-03-10

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Natalie B. Feilchenfeld ,  BethAnn Lawrence ,  Yun Shi

IPC: H01L21/76 ,  H01L23/48 ,  H01L21/768 ,  H01L23/535 ,  H01L21/762 ,  H01L29/06 ,  H01L27/12 ,  H01L21/74 ,  H01L23/528

CPC classification number: H01L23/535 ,  H01L21/743 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/528 ,  H01L27/1207 ,  H01L29/0649 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of forming a semiconductor structure in a semiconductor-on-insulator (SOI) substrate and semiconductor structure so formed are provided. The SOI substrate includes a semiconductor layer; a bulk semiconductor region underlying the semiconductor layer; and an insulation layer between the two. The structure includes first and second openings each having sidewalls, each of the first opening and the second opening formed substantially simultaneously and extending from a top surface of the semiconductor layer through the semiconductor layer and through the insulation layer to the conductive region; an insulating material adapted to provide electrical insulation to at least a portion of the side walls of the first opening; a semiconductor material at least partially filling the first opening, the semiconductor material defining an ohmic contact trench providing electrical contact with the semiconductor region; and an insulating material disposed in the second opening and defining a device isolation trench.

公开(公告)号：US20160190067A1

公开(公告)日：2016-06-30

申请号：US15066374

申请日：2016-03-10

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Natalie B. Feilchenfeld ,  BethAnn Lawrence ,  Yun Shi

IPC: H01L23/535 ,  H01L23/528 ,  H01L29/06

CPC classification number: H01L23/535 ,  H01L21/743 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/528 ,  H01L27/1207 ,  H01L29/0649 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of forming a semiconductor structure in a semiconductor-on-insulator (SOI) substrate and semiconductor structure so formed are provided. The SOI substrate includes a semiconductor layer; a bulk semiconductor region underlying the semiconductor layer; and an insulation layer between the two. The structure includes first and second openings each having sidewalls, each of the first opening and the second opening formed substantially simultaneously and extending from a top surface of the semiconductor layer through the semiconductor layer and through the insulation layer to the conductive region; an insulating material adapted to provide electrical insulation to at least a portion of the side walls of the first opening; a semiconductor material at least partially filling the first opening, the semiconductor material defining an ohmic contact trench providing electrical contact with the semiconductor region; and an insulating material disposed in the second opening and defining a device isolation trench.

Abstract translation: 提供一种在绝缘体上半导体（SOI）衬底和如此形成的半导体结构中形成半导体结构的方法。 SOI衬底包括半导体层; 半导体层下面的体半导体区域; 和两者之间的绝缘层。 该结构包括每个具有侧壁的第一和第二开口，第一开口和第二开口中的每一个基本上同时形成并且从半导体层的顶表面延伸穿过半导体层并且通过绝缘层延伸到导电区域; 绝缘材料，其适于向所述第一开口的侧壁的至少一部分提供电绝缘; 至少部分地填充所述第一开口的半导体材料，所述半导体材料限定提供与所述半导体区域的电接触的欧姆接触沟槽; 以及设置在所述第二开口中并限定器件隔离沟槽的绝缘材料。