Printed circuit boards fabricated using congruent molds
    2.
    发明授权
    Printed circuit boards fabricated using congruent molds 有权
    使用一致模具制造的印刷电路板

    公开(公告)号:US09247649B2

    公开(公告)日:2016-01-26

    申请号:US13887807

    申请日:2013-05-06

    发明人: Craig N. DeVarney

    IPC分类号: H05K3/00 H05K3/04

    摘要: Methods for fabricating printed circuit boards, devices for use in the fabrication of printed circuit boards, and structures for a printed circuit board. A mold may be formed as a device that includes a plurality of features, such as recesses, corresponding to a layout of a plurality of conductors for the printed circuit board. A sheet comprised of an electrically-conductive material may be deformed to match the features of the mold. A substrate may then be added to support the sheet, and the sheet may be selectively removed with a mechanical process to define the conductors of the printed circuit board.

    摘要翻译: 制造印刷电路板的方法,用于制造印刷电路板的装置以及用于印刷电路板的结构。 模具可以形成为包括对应于用于印刷电路板的多个导体的布局的多个特征(例如凹部)的装置。 由导电材料构成的片材可以变形以匹配模具的特征。 然后可以添加衬底以支撑片材,并且可以用机械工艺选择性地去除片材以限定印刷电路板的导体。