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    ELECTRONIC DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    ELECTRONIC DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
    电子器件嵌入式基板及其制造方法

    公开(公告)号：US20160165733A1

    公开(公告)日：2016-06-09

    申请号：US14963690

    申请日：2015-12-09

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Bong-Soo KIM

    IPC分类号： H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H05K3/30

    CPC分类号： H05K1/183 ,  H05K1/186 ,  H05K3/0047 ,  H05K3/325 ,  H05K3/326 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2203/107

    摘要： An electronic device embedded substrate and a method of manufacturing the same includes a substrate comprising a cavity formed therein, and an electronic device embedded in the cavity. The substrate and method thereof also include a first support pattern part formed on one surface of the substrate and pressing the electronic device to restrict a movement of the electronic device within the cavity, and a second support pattern part formed on another surface of the core substrate facing opposite to the one surface and extended toward an inside of the cavity to support the electronic device.

    摘要翻译： 电子器件嵌入式基板及其制造方法包括：基板，其包括形成在其中的空腔;以及嵌入在该空腔中的电子器件。 基板及其方法还包括形成在基板的一个表面上的第一支撑图案部分，并且按压电子装置以限制电子装置在空腔内的移动，以及形成在芯基板的另一表面上的第二支撑图案部分 面向一个表面的相反侧并且朝向空腔的内部延伸以支撑电子设备。

    METHOD FOR MANUFACTURING ANTENNA SHEET
    7.
    发明申请
    METHOD FOR MANUFACTURING ANTENNA SHEET 审中-公开
    制造天线片的方法

    公开(公告)号：US20150302291A1

    公开(公告)日：2015-10-22

    申请号：US14753843

    申请日：2015-06-29

    申请人： TOPPAN PRINTING CO., LTD.

    发明人： Hiroyoshi GOTOU

    IPC分类号： G06K19/077 ,  H05K3/40

    CPC分类号： G06K19/07783 ,  G06K19/07754 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10098 ,  H05K2203/0195 ,  H05K2203/107 ,  Y10T29/49016 ,  Y10T29/49018

    摘要： A method for manufacturing an antenna sheet. The method is for connecting at least one of an antenna coil and a connection pattern, to a conductive member. The at least one of the antenna coil and the connection pattern is provided on one surface of a substrate and the conductive member is provided on the other surface of the substrate. The method includes a pressing process performed to form a first through hole to the substrate, wherein the first through hole passes through the substrate, and to bring the at least one of the antenna coil and the connection pattern, and the conductive member into contact with each other. The method also includes a melting process performed to melt the at least one of the antenna coil and the connection pattern, and the conductive member to each other.

    摘要翻译： 一种天线片的制造方法。 该方法用于将天线线圈和连接图案中的至少一个连接到导电构件。 天线线圈和连接图案中的至少一个设置在基板的一个表面上，并且导电构件设置在基板的另一个表面上。 该方法包括对基板形成第一通孔进行压制处理，其中第一通孔穿过基板，并使天线线圈和连接图案中的至少一个与导电部件接触 彼此。 该方法还包括将天线线圈和连接图案中的至少一个和导电构件彼此熔化的熔化过程。

    LAMINATE INCLUDING CONDUCTIVE CIRCUIT PATTERNS
    8.
    发明申请
    LAMINATE INCLUDING CONDUCTIVE CIRCUIT PATTERNS 审中-公开
    包括导电电路图案的层压板

    公开(公告)号：US20150264812A1

    公开(公告)日：2015-09-17

    申请号：US14724242

    申请日：2015-05-28

    申请人： TECNOMAR OY

    发明人： Tom MARTTILA

    IPC分类号： H05K1/11

    CPC分类号： H05K1/115 ,  B32B37/1292 ,  B32B38/10 ,  B32B2310/0843 ,  B32B2457/08 ,  G08B13/244 ,  H05K1/0366 ,  H05K1/0386 ,  H05K3/027 ,  H05K3/046 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/0284 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0522 ,  H05K2203/1388 ,  H05K2203/1394 ,  H05K2203/1545 ,  Y10T29/49156

    摘要： A laminate contains conductive circuit patterns, a substrate material, and an adhesive pattern or other bond. Each conductive circuit pattern and the substrate material are interconnected by the adhesive pattern or other bond, having its size and shape substantially matching the main outlines of each conductive circuit pattern. Each conductive circuit pattern has thin lines and thin interline spaces, patterned on top of the adhesive pattern or other bond by a removal of conductive material, such that the circuit pattern's thin interline spaces may have residues of the adhesive patterns or other bond. Outside the conductive circuit patterns' main outlines, the substrate material is substantially void of an adhesive or other bond, with the exception of edge areas of the main outlines.

    摘要翻译： 层压体包含导电电路图案，基底材料和粘合剂图案或其它粘结。 每个导电电路图案和衬底材料通过粘合剂图案或其他结合物相互连接，其尺寸和形状基本上与每个导电电路图案的主要轮廓相匹配。 每个导电电路图案具有细线和薄的间隙空间，通过去除导电材料在粘合剂图案的顶部图案化或其他结合图案，使得电路图案的细间线空间可以具有粘合剂图案或其它粘合物的残留物。 在导电电路图案的主要轮廓之外，除了主轮廓的边缘区域之外，基底材料基本上不含粘合剂或其它粘合物。

    HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE
    9.
    发明申请
    HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE 有权
    高频信号传输线和电子设备

    公开(公告)号：US20150036303A1

    公开(公告)日：2015-02-05

    申请号：US14520504

    申请日：2014-10-22

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Kuniaki YOSUI ,  Noboru KATO

    IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/14

    CPC分类号： H05K1/025 ,  H01P3/08 ,  H01P3/085 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/147 ,  H05K1/148 ,  H05K2201/0382

    摘要： A high-frequency signal transmission line includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided at the dielectric element assembly, and a first ground conductor provided on a first side in a direction of lamination relative to the signal line and including a plurality of openings arranged along the signal line. The dielectric layer positioned at an end of the first side in the direction of lamination includes an undulating portion provided on a first principal surface located on the first side in the direction of lamination, such that the undulating portion overlaps with the openings when viewed in a plan view in the direction of lamination.

    摘要翻译： 高频信号传输线包括：介质元件组件，其包括彼此层压的多个电介质层，设置在电介质元件组件处的线性信号线;以及第一接地导体，其设置在层叠相对方向上的第一侧上 并且包括沿信号线布置的多个开口。 位于层叠方向上的第一侧端部的电介质层包括设置在层叠方向上位于第一侧的第一主表面上的起伏部分，使得当以层叠方式观察时起伏部分与开口重叠 在层叠方向的平面图。

    Method for manufacturing electronic device
    10.
    发明授权
    Method for manufacturing electronic device 有权
    电子设备制造方法

    公开(公告)号：US08121394B2

    公开(公告)日：2012-02-21

    申请号：US12050598

    申请日：2008-03-18

    申请人： Takashi Miyauchi

    发明人： Takashi Miyauchi

    IPC分类号： G06K9/00

    CPC分类号： H05K3/323 ,  G02F1/1303 ,  G02F1/1309 ,  G02F1/13452 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2924/00011 ,  H05K1/0269 ,  H05K2201/0108 ,  H05K2201/0382 ,  H05K2203/163 ,  H01L2224/29075

    摘要： A method for manufacturing an electronic device is provided. The method includes: pressure-bonding a plurality of terminals of an electronic component to a plurality of electrodes formed on a surface of a transparent substrate, respectively, via an anisotropic conductive film to mount the electronic component on the transparent substrate; obtaining an image of the electrodes by imaging the transparent substrate with the electronic component mounted thereon from backside of the transparent substrate; measuring the number of indentations for each said electrode using the image of the electrode, the indentation being formed when the electrode is pressed by a conductive particle in the anisotropic conductive film; calculating an average and a standard deviation of the number of indentations per electrode throughout the transparent substrate; and calculating a probability that the number of indentations per electrode is less than a reference value on basis of the average and the standard deviation.

    摘要翻译： 提供了一种用于制造电子设备的方法。 该方法包括：通过各向异性导电膜将电子部件的多个端子分别压接到形成在透明基板的表面上的多个电极，以将电子部件安装在透明基板上; 通过从透明基板的背面安装有电子部件的透明基板成像来获得电极的图像; 使用电极的图像测量每个所述电极的压痕数量，当电极被各向异性导电膜中的导电颗粒挤压时形成凹陷; 计算每个电极在整个透明基板上的压痕数量的平均值和标准偏差; 并根据平均值和标准偏差计算每个电极的压痕数量小于参考值的概率。