公开(公告)号：US10049909B2

公开(公告)日：2018-08-14

申请号：US15432560

申请日：2017-02-14

Applicant: GLOBALFOUNDRIES INC.

Inventor： John J. Garant ,  Jonathan H. Griffith ,  Brittany L. Hedrick ,  Edmund J. Sprogis

IPC: H01L21/683 ,  B32B37/24 ,  B32B38/10 ,  B81C1/00

Abstract: A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.

公开(公告)号：US20170154800A1

公开(公告)日：2017-06-01

申请号：US15432560

申请日：2017-02-14

Applicant: GLOBALFOUNDRIES INC.

Inventor： John J. Garant ,  Jonathan H. Griffith ,  Brittany L. HEDRICK ,  Edmund J. Sprogis

IPC: H01L21/683 ,  B32B38/10 ,  B32B37/24

CPC classification number: H01L21/6835 ,  B32B37/24 ,  B32B38/10 ,  B32B2037/246 ,  B32B2315/08 ,  B32B2457/14 ,  B81C1/00666 ,  B81C2201/0167 ,  H01L2221/68304 ,  H01L2221/68327

Abstract: A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.