公开(公告)号：US09390884B2

公开(公告)日：2016-07-12

申请号：US14274042

申请日：2014-05-09

Applicant: GLOBALFOUNDRIES INC.

Inventor： Eric C. Harley ,  Oliver D. Patterson ,  Kevin T. Wu

IPC: H01L21/00 ,  H01J37/22 ,  H01J37/244 ,  G01N23/225 ,  G01B15/02

CPC classification number: H01J37/222 ,  G01B15/02 ,  G01N23/2251 ,  H01J37/244 ,  H01J2237/063 ,  H01J2237/221 ,  H01J2237/24495 ,  H01J2237/24592

Abstract: A semiconductor substrate inspection system includes an e-beam inspection system configured to deliver electrons to a specimen semiconductor substrate. A sensor is configured to detect reflected electrons that reflect off the surface of the specimen semiconductor substrate. An analysis unit is configured to determine a number of electrons received by the semiconductor substrate, and to determine at least one target region including at least one defect of the semiconductor substrate. A reference image module is in electrical communication with the analysis unit. The reference image module is configured to generate a first digital image having a plurality of pixels, and to adjust a gray-scale level of the pixels included in the target region based on the number electrons included in each pixel to generate a second digital image that excludes the at least one defect.

Abstract translation: 半导体衬底检查系统包括被配置为将电子传递到样本半导体衬底的电子束检查系统。 传感器被配置为检测从样本半导体衬底的表面反射的反射电子。 分析单元被配置为确定由半导体衬底接收的电子数量，并且确定至少一个包括半导体衬底的至少一个缺陷的目标区域。 参考图像模块与分析单元电连通。 参考图像模块被配置为生成具有多个像素的第一数字图像，并且基于包括在每个像素中的数量的电子像素来调整包括在目标区域中的像素的灰度级别以产生第二数字图像， 排除至少一个缺陷。