Method and Apparatus for Plasma Processing
    3.
    发明公开

    公开(公告)号:US20230230814A1

    公开(公告)日:2023-07-20

    申请号:US18189519

    申请日:2023-03-24

    Abstract: A method of processing includes directing an electron beam comprising ballistic electrons from an electron source towards a peripheral region of a substrate to be processed. The peripheral region surrounds a central region of the substrate. The electron beam may be directed such that the ballistic electrons impinge on the peripheral region and not on the central region of the substrate. The ballistic electrons may stimulate chemical reactions on the substrate. The method may include placing the substrate on a substrate holder disposed within a vacuum chamber. The method may also include generating the electron beam from a plasma in the vacuum chamber. The method may further include processing the substrate with ions from the plasma.

    Radiation Analyzing Apparatus
    6.
    发明申请

    公开(公告)号:US20180275079A1

    公开(公告)日:2018-09-27

    申请号:US15928807

    申请日:2018-03-22

    Abstract: The radiation analyzing apparatus irradiates an object including a plurality of elements with a first radiation, detects a plurality of rays of a second radiation emitted from the object irradiated with the first radiation, derives an energy spectrum based on a signal of each of the plurality of rays of the second radiation, detects detection energy, which is energy absorbed in a reference element that is an element used as a reference or is energy emitted from the reference element, based on the energy spectrum, and corrects the energy spectrum based on reference energy information, which is previously stored in a storage unit and indicates reference energy that is energy absorbed in the reference element or is energy emitted from the reference element, and the detection energy.

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