公开(公告)号：US20170139324A1

公开(公告)日：2017-05-18

申请号：US14940857

申请日：2015-11-13

Applicant: GLOBALFOUNDRIES INC.

Inventor： Qin Yuan ,  Mark Chace ,  Jun Liu ,  Janine L. Protzman ,  Victoria L. Calero diaz del castillo

IPC: G03F7/038 ,  H01L21/02 ,  H01L23/31 ,  G03F7/20 ,  H01L23/29

CPC classification number: G03F7/0387 ,  C08F283/04 ,  G03F7/029 ,  H01L21/02118 ,  H01L21/02348 ,  H01L23/293 ,  C08F220/20 ,  C08F220/56

Abstract: A formulation comprising an esterified polyamide resin with a photosensitive linkage, a polymerizable crosslinker, and an organic species is provided. The organic species is selected such that (a) when exposed to UV radiation, it copolymerizes with the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin forming the crosslinking network, (b) during thermal cure the copolymer thus formed drops from polyimide backbones, and (c) wherein the thermal degradation temperature of the copolymer thus formed is lower than the thermal degradation temperature of the homopolymer formed from the polymerizable crosslinker and the thermal degradation temperature of the copolymer formed from the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin. The formulation is useful in forming a semiconductor passivation layer and facilitates more complete removal of crosslinker using less stringent conditions.

公开(公告)号：US09740101B2

公开(公告)日：2017-08-22

申请号：US14940857

申请日：2015-11-13

Applicant: GLOBALFOUNDRIES INC.

Inventor： Qin Yuan ,  Mark Chace ,  Jun Liu ,  Janine L. Protzman ,  Victoria L. Calero diaz del castillo

IPC: G03F7/037 ,  G03F7/038 ,  G03F7/20 ,  H01L23/29 ,  H01L23/31 ,  H01L21/02

CPC classification number: G03F7/0387 ,  C08F283/04 ,  G03F7/029 ,  H01L21/02118 ,  H01L21/02348 ,  H01L23/293 ,  C08F220/20 ,  C08F220/56

Abstract: A formulation comprising an esterified polyamide resin with a photosensitive linkage, a polymerizable crosslinker, and an organic species is provided. The organic species is selected such that (a) when exposed to UV radiation, it copolymerizes with the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin forming the crosslinking network, (b) during thermal cure the copolymer thus formed drops from polyimide backbones, and (c) wherein the thermal degradation temperature of the copolymer thus formed is lower than the thermal degradation temperature of the homopolymer formed from the polymerizable crosslinker and the thermal degradation temperature of the copolymer formed from the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin. The formulation is useful in forming a semiconductor passivation layer and facilitates more complete removal of crosslinker using less stringent conditions.