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公开(公告)号：US10283469B1
公开(公告)日：2019-05-07
申请号：US15795849
申请日：2017-10-27
Applicant: GLOBALFOUNDRIES Inc.
Abstract: A method of forming a passivation layer on an integrated circuit (IC) chip including a device layer on a substrate. The method may include forming a crosslinked precursor passivation layer on the IC chip, and curing the crosslinked precursor passivation layer at a first temperature to form a passivation layer. The method may further include maintaining the device layer at a second, lower temperature during the curing of the crosslinked precursor passivation layer. Maintaining the device layer at the second, lower temperature may mitigate and/or prevent damage to the device layer conventionally caused by exposure to the first temperature during the curing of the crosslinked precursor passivation layer. The method may include using a curing system including a chamber, an infrared source for controlling the first temperature for curing the crosslinked precursor passivation layer, and a temperature control device for controlling the second, lower temperature of the device layer.
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公开(公告)号：US09740101B2
公开(公告)日：2017-08-22
申请号：US14940857
申请日：2015-11-13
Applicant: GLOBALFOUNDRIES INC.
Inventor： Qin Yuan , Mark Chace , Jun Liu , Janine L. Protzman , Victoria L. Calero diaz del castillo
CPC classification number: G03F7/0387 , C08F283/04 , G03F7/029 , H01L21/02118 , H01L21/02348 , H01L23/293 , C08F220/20 , C08F220/56
Abstract: A formulation comprising an esterified polyamide resin with a photosensitive linkage, a polymerizable crosslinker, and an organic species is provided. The organic species is selected such that (a) when exposed to UV radiation, it copolymerizes with the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin forming the crosslinking network, (b) during thermal cure the copolymer thus formed drops from polyimide backbones, and (c) wherein the thermal degradation temperature of the copolymer thus formed is lower than the thermal degradation temperature of the homopolymer formed from the polymerizable crosslinker and the thermal degradation temperature of the copolymer formed from the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin. The formulation is useful in forming a semiconductor passivation layer and facilitates more complete removal of crosslinker using less stringent conditions.
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Patent Agency Ranking
公开(公告)号：US09551696B2
公开(公告)日：2017-01-24
申请号：US14311380
申请日：2014-06-23
Applicant: GLOBALFOUNDRIES INC.
Inventor： Mark S. Chace , Martin Glodde , Margaret C. Lawson , Janine L. Protzman , Qin Yuan
CPC classification number: G01N33/44 , B08B7/00 , B08B7/0035 , B08B7/04 , G01N1/44 , G03F7/70916
Abstract: A method of testing the cleanability of polymerized sublimate outgassed from a lithography material during a thermal heating process including; placing a wafer on a wafer hotplate inside a chamber with the wafer being covered by a lithography material; placing a target, having a starting composition, above the wafer in the chamber; heating the wafer using the wafer hotplate in an attempt to outgas a sublimate, where the sublimate condenses on the target; forming a polymerized sublimate on the target; and applying organic solvents to the target to determine the cleanability of the polymerized sublimate.
Abstract translation: 一种在热加热过程中测试从光刻材料脱气的聚合升华物的可清洁性的方法，包括： 将晶片放置在室内的晶片加热板上，晶片被光刻材料覆盖; 将具有起始组成的靶放置在所述腔中的所述晶片之上; 使用晶片加热板加热晶片以试图排出升华，其中升华在目标上冷凝; 在目标上形成聚合的升华; 并向目标物施加有机溶剂以确定聚合的升华物的可清洁性。
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公开(公告)号：US20190131259A1
公开(公告)日：2019-05-02
申请号：US15795849
申请日：2017-10-27
Applicant: GLOBALFOUNDRIES Inc.
Abstract: A method of forming a passivation layer on an integrated circuit (IC) chip including a device layer on a substrate. The method may include forming a crosslinked precursor passivation layer on the IC chip, and curing the crosslinked precursor passivation layer at a first temperature to form a passivation layer. The method may further include maintaining the device layer at a second, lower temperature during the curing of the crosslinked precursor passivation layer. Maintaining the device layer at the second, lower temperature may mitigate and/or prevent damage to the device layer conventionally caused by exposure to the first temperature during the curing of the crosslinked precursor passivation layer. The method may include using a curing system including a chamber, an infrared source for controlling the first temperature for curing the crosslinked precursor passivation layer, and a temperature control device for controlling the second, lower temperature of the device layer.
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公开(公告)号：US20170139324A1
公开(公告)日：2017-05-18
申请号：US14940857
申请日：2015-11-13
Applicant: GLOBALFOUNDRIES INC.
Inventor： Qin Yuan , Mark Chace , Jun Liu , Janine L. Protzman , Victoria L. Calero diaz del castillo
CPC classification number: G03F7/0387 , C08F283/04 , G03F7/029 , H01L21/02118 , H01L21/02348 , H01L23/293 , C08F220/20 , C08F220/56
Abstract: A formulation comprising an esterified polyamide resin with a photosensitive linkage, a polymerizable crosslinker, and an organic species is provided. The organic species is selected such that (a) when exposed to UV radiation, it copolymerizes with the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin forming the crosslinking network, (b) during thermal cure the copolymer thus formed drops from polyimide backbones, and (c) wherein the thermal degradation temperature of the copolymer thus formed is lower than the thermal degradation temperature of the homopolymer formed from the polymerizable crosslinker and the thermal degradation temperature of the copolymer formed from the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin. The formulation is useful in forming a semiconductor passivation layer and facilitates more complete removal of crosslinker using less stringent conditions.
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6.发明申请公开(公告)号：US20170154763A1
公开(公告)日：2017-06-01
申请号：US14954053
申请日：2015-11-30
Applicant: GLOBALFOUNDRIES INC.
Inventor： Qin Yuan , Mark S. Chace , Steven E. Molis , Janine L. Protzman
CPC classification number: H01J49/0463 , H01J49/0404
Abstract: A mass spectrometer system includes a chamber configured to receive a sample; a gas source coupled to the chamber for delivering a gas across the sample; and a desorption energy source configured to desorb a contaminant from a test area of the sample. The system may also include a mass spectrometer including a vacuum source, an ion source, a mass analyzer and a detector, and a capillary transfer line operatively coupled to the chamber and the mass spectrometer and configured to deliver desorbed volatiles of the contaminant from the test area to the mass spectrometer, the capillary transfer line having an intake proximal the test area. A method of identifying a contaminant is also disclosed.
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公开(公告)号：US09604316B2
公开(公告)日：2017-03-28
申请号：US14493818
申请日：2014-09-23
Applicant: GLOBALFOUNDRIES INC.
Inventor： Charles L. Arvin , Mark S. Chace , Qin Yuan , Nitin Jadhav , Janine L. Protzman
CPC classification number: B23K35/262 , B23K1/20 , B23K35/0222 , B23K35/3612 , C23C18/48 , H05K3/3473 , H05K2203/044
Abstract: A tin-based solder melt or aqueous tin plating bath composition comprising a source of tin and a stabilizing additive of chemical structure: wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, and R10 are independently selected from hydrogen atom, hydrocarbon groups R having at least one and up to twelve carbon atoms, groups OR′ wherein R′ is selected from hydrogen atom and hydrocarbon groups R, and halogen atoms, and wherein any two, three, or four of R1, R2, R3, R4, and R5 or any two, three, or four of R6, R7, R8, R9, and R10 are optionally interconnected to form a fused ring system; R11 and R12 are independently selected from hydrogen atom and hydrocarbon groups R; and r is either 0 or 1. Methods for coating and/or bonding metal substrates by use of the above-described solder compositions are also described.
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