公开(公告)号：US20190079408A1

公开(公告)日：2019-03-14

申请号：US15698775

申请日：2017-09-08

Applicant: GLOBALFOUNDRIES INC.

Inventor： Sohan Singh Mehta ,  Mark C. Duggan ,  Sunil Kumar Singh ,  Robert Justin Morgan ,  SherJang Singh ,  Ravi Prakash Srivastava ,  Craig D. Higgins ,  Jason L. Behnke ,  Vineet Sharma

IPC: G03F7/32

Abstract: The disclosure is directed to a method for lithographic patterning. The method may include: exposing a photoresist to a radiant energy; developing the photoresist in a first developer, thereby creating an opening within the photoresist including sidewalls having a slant; and developing the photoresist in a second developer immediately after the developing of the photoresist in the first developer, thereby reducing the slant of the sidewalls of the opening. Where the photoresist is a positive tone development (PTD) photoresist, the first developer may include a positive developer, and the second developer may include a negative developer. Where the photoresist is a negative tone development (NTD) photoresist, the first developer may include a negative developer, and the second developer may include a positive developer.