DOUBLE BARRIER LAYER SETS FOR CONTACTS IN SEMICONDUCTOR DEVICE

    公开(公告)号:US20190067098A1

    公开(公告)日:2019-02-28

    申请号:US15687591

    申请日:2017-08-28

    Abstract: Methods of forming a contact for a semiconductor device with double barrier layer sets, and a device so formed are disclosed. Methods may include: depositing a first metal layer contacting a semiconductor substrate in a contact opening; depositing a first nitride barrier layer on the first metal layer; and annealing after depositing the first nitride barrier layer to form silicide region in a junction area underlying the contact opening with the first metal layer and the semiconductor substrate. After the annealing, a second metal layer may be deposited, followed by a second nitride barrier layer. A conductor is formed in a remaining portion of the contact opening. The double barrier layer sets prevent the formation of volcano defects and also advantageously reduce contact resistance.

    Multi-layer spacer used in finFET
    2.
    发明授权
    Multi-layer spacer used in finFET 有权
    用于finFET的多层间隔物

    公开(公告)号:US09419101B1

    公开(公告)日:2016-08-16

    申请号:US14932394

    申请日:2015-11-04

    Abstract: A method of forming spacers and the resulting fin-shaped field effect transistors are provided. Embodiments include forming a silicon (Si) fin over a substrate; forming a polysilicon gate over the Si fin; and forming a spacer on top and side surfaces of the polysilicon gate, and on exposed upper and side surfaces of the Si fin, the spacer including: a first layer and second layer having a first dielectric constant, and a third layer formed between the first and second layers and having a second dielectric constant, wherein the second dielectric constant is lower than the first dielectric constant.

    Abstract translation: 提供了形成间隔物的方法和所得的鳍状场效应晶体管。 实施例包括在衬底上形成硅(Si)鳍; 在Si鳍上形成多晶硅栅极; 以及在所述多晶硅栅极的顶表面和侧表面上形成间隔物,并且在所述Si鳍的暴露的上表面和外表面上,所述间隔物包括:具有第一介电常数的第一层和第二层,以及形成在所述第一 和第二层并具有第二介电常数,其中第二介电常数低于第一介电常数。

    Double barrier layer sets for contacts in semiconductor device

    公开(公告)号:US10453747B2

    公开(公告)日:2019-10-22

    申请号:US15687591

    申请日:2017-08-28

    Abstract: Methods of forming a contact for a semiconductor device with double barrier layer sets, and a device so formed are disclosed. Methods may include: depositing a first metal layer contacting a semiconductor substrate in a contact opening; depositing a first nitride barrier layer on the first metal layer; and annealing after depositing the first nitride barrier layer to form silicide region in a junction area underlying the contact opening with the first metal layer and the semiconductor substrate. After the annealing, a second metal layer may be deposited, followed by a second nitride barrier layer. A conductor is formed in a remaining portion of the contact opening. The double barrier layer sets prevent the formation of volcano defects and also advantageously reduce contact resistance.

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