Advanced self-aligned patterning process with sit spacer as a final dielectric etch hardmask

    公开(公告)号:US09704746B1

    公开(公告)日:2017-07-11

    申请号:US15235892

    申请日:2016-08-12

    CPC classification number: H01L21/76802 H01L21/0337 H01L21/31144

    Abstract: A method of forming a metallization layer by ASAP is provided. Embodiments include forming an ULK layer; forming a SAC SiN layer over the ULK layer; forming mandrels directly on the SAC SiN layer; cutting the mandrels; selectively etching the SAC SiN layer across the cut mandrels, forming first trenches; filling the first trenches with a metal oxide; forming a conformal metal oxide layer over the cut mandrels, the metal oxide, and the SAC SiN layer; removing horizontal portions of the conformal metal oxide layer over the cut mandrels and the SAC SiN layer; removing the cut mandrels; removing exposed portions of the SAC SiN layer and etching the underlying ULK layer, forming second trenches; and stripping a remainder of the metal oxide, conformal metal oxide layer, and SAC SiN layer.

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