公开(公告)号：US09478489B2

公开(公告)日：2016-10-25

申请号：US14138881

申请日：2013-12-23

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Daniel Richter ,  Frank Kuechenmeister

IPC: H01L23/13 ,  H01L23/522 ,  H01L29/06 ,  H01L21/78 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L23/522 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L29/0657 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The width of scribe lines may be reduced in semiconductor devices by applying a process technique in which trenches may be formed first from the rear side on the basis of a required width of the corresponding trenches, while subsequently it may be cut into the substrate from the front side on the basis of a reduced thickness of the corresponding saw blades, thereby also enabling a reduction of the scribe line width. Furthermore, contamination of the front side, i.e., of the metallization system, may be reduced, for instance, by performing an optional intermediate cleaning process.

Abstract translation: 可以通过施加一种工艺技术来减少划线的宽度，其中可以基于相应沟槽的所需宽度从后侧首先形成沟槽，然后可以从其中切割出衬底 基于相应锯片的厚度减小的前侧，从而也能够减少划线宽度。 此外，例如，通过执行任选的中间清洁处理，可以减少前侧，即金属化系统的污染。

公开(公告)号：US20140110854A1

公开(公告)日：2014-04-24

申请号：US14138881

申请日：2013-12-23

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Daniel Richter ,  Frank Kuechenmeister

IPC: H01L23/522

CPC classification number: H01L23/522 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L29/0657 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The width of scribe lines may be reduced in semiconductor devices by applying a process technique in which trenches may be formed first from the rear side on the basis of a required width of the corresponding trenches, while subsequently it may be cut into the substrate from the front side on the basis of a reduced thickness of the corresponding saw blades, thereby also enabling a reduction of the scribe line width. Furthermore, contamination of the front side, i.e., of the metallization system, may be reduced, for instance, by performing an optional intermediate cleaning process.

Abstract translation: 可以通过施加一种工艺技术来减少划线的宽度，其中可以基于相应沟槽的所需宽度从后侧首先形成沟槽，然后可以从其中切割出衬底 基于相应锯片的厚度减小的前侧，从而也能够减少划线宽度。 此外，例如，通过执行任选的中间清洁处理，可以减少前侧，即金属化系统的污染。