公开(公告)号：US10795082B1

公开(公告)日：2020-10-06

申请号：US16540452

申请日：2019-08-14

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Ajey Poovannummoottil Jacob ,  Yusheng Bian ,  Theodore Letavic ,  Kenneth J. Giewont ,  Steven M. Shank

IPC: G02B6/124 ,  G02B6/12 ,  G02B6/13

Abstract: Structures that include a Bragg grating and methods of fabricating a structure that includes a Bragg grating. Bragg elements are positioned adjacent to a waveguide. The Bragg elements are separated by grooves that alternate with the Bragg elements. A dielectric layer includes portions positioned to close the grooves to define airgaps. The airgaps are respectively arranged between adjacent pairs of the Bragg elements. The Bragg elements may be used to form the Bragg grating.

公开(公告)号：US10224286B1

公开(公告)日：2019-03-05

申请号：US15883693

申请日：2018-01-30

Applicant: GLOBALFOUNDRIES INC.

Inventor： Luke G. England ,  Kenneth J. Giewont

IPC: H01L23/538 ,  H01L23/49 ,  H01L21/768 ,  H01L21/48 ,  H01L25/16

Abstract: Embodiments of the disclosure provide an interconnect structure including: a first die having a first surface and an opposing second surface, and a groove within first surface of the first die; an adhesive dielectric layer mounted to the opposing second surface of the first die; a second die having a first surface mounted to the adhesive dielectric layer, and an opposing second surface, wherein the adhesive dielectric layer is positioned directly between the first and second dies; and a through-semiconductor via (TSV) including a first TSV metal extending from the first surface of the first die to the adhesive dielectric layer, and a second TSV metal substantially aligned with the first TSV metal and extending from the adhesive dielectric layer to the opposing second surface of the second die, wherein the TSV includes a metal-to-metal bonding interface between the first and second TSV metals within the adhesive dielectric layer.

公开(公告)号：US10444433B1

公开(公告)日：2019-10-15

申请号：US16170262

申请日：2018-10-25

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Yusheng Bian ,  Abu Thomas ,  Ajey Poovannummoottil Jacob ,  Kenneth J. Giewont ,  Karen Nummy ,  Andreas Stricker ,  Bo Peng

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/12

Abstract: Structures that include a waveguide and methods of fabricating a structure that includes a waveguide. A tapered feature composed of a dielectric material is arranged over the waveguide. The tapered feature includes a sidewall that is angled relative to a longitudinal axis of the waveguide.