Methods of facilitating fabricating transistors
    2.
    发明授权
    Methods of facilitating fabricating transistors 有权
    促进制造晶体管的方法

    公开(公告)号:US09425100B1

    公开(公告)日:2016-08-23

    申请号:US14694276

    申请日:2015-04-23

    Abstract: Methods and transistors for circuit structures are provided. The methods include, for instance: defining a channel region in a substrate, the channel region having at least one channel region sidewall adjoining an isolation material; recessing the isolation material to expose an upper portion of the at least one channel region sidewall; and providing a gate structure over a gate interface area with the channel region. The gate interface area includes at least the upper portion of the at least one channel region sidewall and an upper surface of the channel region so that a threshold voltage of the gate structure may be reduced. The methods may also include etching an elongate notch in the upper portion of the at least one channel region sidewall to increase a size of the gate interface area and further reduce the threshold voltage of the gate structure.

    Abstract translation: 提供了用于电路结构的方法和晶体管。 所述方法包括例如:在衬底中限定沟道区,所述沟道区具有邻近隔离材料的至少一个沟道区侧壁; 使隔离材料凹陷以暴露至少一个通道区域侧壁的上部; 以及在与沟道区域的栅极接口区域上提供栅极结构。 栅极界面区域至少包括至少一个沟道区域侧壁的上部和沟道区域的上表面,使得可以减小栅极结构的阈值电压。 所述方法还可以包括蚀刻在所述至少一个沟道区域侧壁的上部中的细长凹口以增加栅极界面面积的尺寸并进一步降低栅极结构的阈值电压。

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