公开(公告)号：US09142437B2

公开(公告)日：2015-09-22

申请号：US13859773

申请日：2013-04-10

Applicant: GLOBALFOUNDRIES Inc.

Inventor： William J. Fosnight ,  Ryan J. Gallagher ,  Stephen B. Miner

IPC: B66F19/00 ,  H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67775 ,  H01L21/67379

Abstract: A system for separately handling different size FOUPs includes an end effector having a surface thereon for supporting a FOUP. The end effector and surface is configured to support different size FOUPs. A fixture or means for engaging and maintaining a FOUP, of different size FOUPs, included to position and maintain each of a different size FOUP on the end effector during transport thereof. A shelf is configured to receive each of said different size FOUPs. The end effector is thus capable of transporting either a first size FOUP or a second, smaller size FOUP.

Abstract translation: 用于分开处理不同尺寸的FOUP的系统包括其上具有用于支撑FOUP的表面的端部执行器。 端部执行器和表面配置为支持不同尺寸的FOUP。 包括用于接合和保持不同尺寸FOUP的FOUP的固定装置或装置，用于在其运送期间在末端执行器上定位和保持每个不同尺寸的FOUP。 架子被配置为接收每个所述不同大小的FOUP。 因此，末端执行器能够运送第一尺寸FOUP或第二较小尺寸的FOUP。

公开(公告)号：US10593575B2

公开(公告)日：2020-03-17

申请号：US15223882

申请日：2016-07-29

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Stephen B. Miner ,  William John Fosnight ,  Ryan J. Gallagher

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673 ,  G05B19/418 ,  H01L21/68

Abstract: Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

公开(公告)号：US20160336206A1

公开(公告)日：2016-11-17

申请号：US15223882

申请日：2016-07-29

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Stephen B. Miner ,  William John Fosnight ,  Ryan J. Gallagher

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673 ,  G05B19/418

Abstract: Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

Abstract translation: 本文公开了用于监测晶片处理的系统，机器和方法。 用于监测晶片处理的系统包括传感器和控制器。 传感器能够固定在组装的晶片处理机上。 控制器与传感器进行电子通信，并包括控制逻辑。 所述控制逻辑被配置为当所述晶片处理机对准时存储所述传感器的参考输出，并且当所述参考输出与所述传感器的当前输出之间的差异超过阈值时被配置为产生指示信号。