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    System for separately handling different size FOUPs
    2.
    发明授权
    System for separately handling different size FOUPs 有权
    用于分别处理不同尺寸的FOUP的系统

    公开(公告)号：US09142437B2

    公开(公告)日：2015-09-22

    申请号：US13859773

    申请日：2013-04-10

    Applicant: GLOBALFOUNDRIES Inc.

    Inventor： William J. Fosnight ,  Ryan J. Gallagher ,  Stephen B. Miner

    IPC: B66F19/00 ,  H01L21/677 ,  H01L21/673

    CPC classification number: H01L21/67775 ,  H01L21/67379

    Abstract: A system for separately handling different size FOUPs includes an end effector having a surface thereon for supporting a FOUP. The end effector and surface is configured to support different size FOUPs. A fixture or means for engaging and maintaining a FOUP, of different size FOUPs, included to position and maintain each of a different size FOUP on the end effector during transport thereof. A shelf is configured to receive each of said different size FOUPs. The end effector is thus capable of transporting either a first size FOUP or a second, smaller size FOUP.

    Abstract translation: 用于分开处理不同尺寸的FOUP的系统包括其上具有用于支撑FOUP的表面的端部执行器。 端部执行器和表面配置为支持不同尺寸的FOUP。 包括用于接合和保持不同尺寸FOUP的FOUP的固定装置或装置，用于在其运送期间在末端执行器上定位和保持每个不同尺寸的FOUP。 架子被配置为接收每个所述不同大小的FOUP。 因此，末端执行器能够运送第一尺寸FOUP或第二较小尺寸的FOUP。

    SYSTEM AND METHOD FOR MONITORING WAFER HANDLING AND A WAFER HANDLING MACHINE
    6.
    发明申请
    SYSTEM AND METHOD FOR MONITORING WAFER HANDLING AND A WAFER HANDLING MACHINE 审中-公开
    用于监控水处理和水处理机的系统和方法

    公开(公告)号：US20160336206A1

    公开(公告)日：2016-11-17

    申请号：US15223882

    申请日：2016-07-29

    Applicant: GLOBALFOUNDRIES, Inc.

    Inventor： Stephen B. Miner ,  William John Fosnight ,  Ryan J. Gallagher

    IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673 ,  G05B19/418

    Abstract: Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

    Abstract translation: 本文公开了用于监测晶片处理的系统，机器和方法。 用于监测晶片处理的系统包括传感器和控制器。 传感器能够固定在组装的晶片处理机上。 控制器与传感器进行电子通信，并包括控制逻辑。 所述控制逻辑被配置为当所述晶片处理机对准时存储所述传感器的参考输出，并且当所述参考输出与所述传感器的当前输出之间的差异超过阈值时被配置为产生指示信号。

    WAFER CARRIER PURGE APPARATUSES, AUTOMATED MECHANICAL HANDLING SYSTEMS INCLUDING THE SAME, AND METHODS OF HANDLING A WAFER CARRIER DURING INTEGRATED CIRCUIT FABRICATION
    7.
    发明申请
    WAFER CARRIER PURGE APPARATUSES, AUTOMATED MECHANICAL HANDLING SYSTEMS INCLUDING THE SAME, AND METHODS OF HANDLING A WAFER CARRIER DURING INTEGRATED CIRCUIT FABRICATION 有权
    WAFER CARRIER PURGE装置，包括其中的自动机械处理系统以及在集成电路制造过程中处理波浪载体的方法

    公开(公告)号：US20160155654A1

    公开(公告)日：2016-06-02

    申请号：US15015578

    申请日：2016-02-04

    Applicant: GLOBALFOUNDRIES, Inc.

    Inventor： William J. Fosnight ,  Stephanie Waite ,  Stephen B. Miner ,  John Robinson

    IPC: H01L21/673 ,  B08B5/02 ,  B08B9/00 ,  H01L21/677

    CPC classification number: H01L21/67389 ,  B08B5/00 ,  B08B5/02 ,  B08B9/00 ,  H01L21/67769 ,  H01L21/67775

    Abstract: A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.

    Abstract translation: 提供了晶片载体清除装置，自动机械处理系统以及在集成电路制造期间处理晶片载体的方法。 晶片载体清洗装置包括适于插入载体存放位置的清洗板。 净化板包括气体端口和与气体端口流体连通的气体喷嘴。 气体端口接收气流。 气体喷嘴适于接触晶片载体的入口。 吹扫板还包括与气体喷嘴间隔开的与真空口流体连通的真空口和真空喷嘴。 真空喷嘴适于捕获通过晶片载体的出口从晶片载体逸出的气体。 净化板是分离的，可从载体存放位置移除。

    Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
    8.
    发明授权
    Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication 有权
    晶片载体清洗装置，包括其的自动机械处理系统以及在集成电路制造期间处理晶片载体的方法

    公开(公告)号：US09257320B2

    公开(公告)日：2016-02-09

    申请号：US13910683

    申请日：2013-06-05

    Applicant: GLOBALFOUNDRIES, Inc.

    Inventor： William J. Fosnight ,  Stephanie Waite ,  Stephen B. Miner ,  John Robinson

    IPC: H01L21/673 ,  H01L21/677 ,  B08B5/02 ,  B08B5/00 ,  B08B9/00

    CPC classification number: H01L21/67389 ,  B08B5/00 ,  B08B5/02 ,  B08B9/00 ,  H01L21/67769 ,  H01L21/67775

    Abstract: A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.

    Abstract translation: 提供了晶片载体清洗装置，自动机械处理系统以及在集成电路制造期间处理晶片载体的方法。 晶片载体清洗装置包括适于插入载体存放位置的清洗板。 净化板包括气体端口和与气体端口流体连通的气体喷嘴。 气体端口接收气流。 气体喷嘴适于接触晶片载体的入口。 吹扫板还包括与气体喷嘴间隔开的与真空口流体连通的真空口和真空喷嘴。 真空喷嘴适于捕获通过晶片载体的出口从晶片载体逸出的气体。 净化板是分离的，可从载体存放位置移除。

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