公开(公告)号：US10707358B2

公开(公告)日：2020-07-07

申请号：US16027363

申请日：2018-07-04

Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.

Inventor： Wanbing Yi ,  Juan Boon Tan ,  Kiok Boone Elgin Quek ,  Khee Yong Lim ,  Chim Seng Seet ,  Rajesh Nair

IPC: H01L31/0216 ,  H01L23/00

Abstract: A semiconductor device having a substrate with at least one photo-detecting region and at least one bond pad is provided. A first passivation layer is deposited over the substrate and over step portions at the edges of the bond pad and a trench having sidewalls and a bottom surface is formed in the substrate. A light shielding layer is deposited over the first passivation layer and covering the trench sidewalls. The light shielding layer has end portions at the photo-detecting region, at step portions at the edges of the bond pad and at the bottom surface of the trench. A second passivation layer is deposited over the light shielding layer. A third passivation layer is deposited over the end portions of the light shielding layer at the photo-detecting region and at the step portions at edges of the bond pad.