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公开(公告)号:US11664432B2
公开(公告)日:2023-05-30
申请号:US16556796
申请日:2019-08-30
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor: Dirk Utess , Zhixing Zhao , Dominik M. Kleimaier , Irfan A. Saadat , Florent Ravaux
IPC: H01L27/092 , H01L29/417 , H01L29/40 , H01L29/78
CPC classification number: H01L29/41775 , H01L27/092 , H01L29/401 , H01L29/7845
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a layout optimization for radio frequency (RF) device performance and methods of manufacture. The structure includes: a first active device on a substrate; source and drain diffusion regions adjacent to the first active device; and a first contact in electrical contact with the source and drain diffusion regions and which is spaced away from the first active device to optimize a stress component in a channel region of the first active device.
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公开(公告)号:US20240284680A1
公开(公告)日:2024-08-22
申请号:US18172027
申请日:2023-02-21
Applicant: GlobalFoundries U.S. Inc.
Inventor: Zhixing Zhao , Dominik M. Kleimaier , Stefan Duenkel
CPC classification number: H10B51/30 , G11C11/2275 , H01L29/78391
Abstract: A ferroelectric memory device includes a substrate including a source region and a drain region, and a gate structure disposed over the substrate. The gate structure includes a gate electrode including a plurality of electrode portions arranged in a first direction parallel to a top surface of the substrate, an oxide layer including a plurality of oxide portions corresponding respectively to the plurality of electrode portions, and a ferroelectric layer disposed between the gate electrode and the oxide layer along a second direction perpendicular to the first direction and including a plurality of ferroelectric portions corresponding respectively to the plurality of oxide portions. A least one of the plurality of oxide portions and at least one of the plurality of ferroelectric portions have different thicknesses along the second direction.
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