公开(公告)号：US20220221101A1

公开(公告)日：2022-07-14

申请号：US17657733

申请日：2022-04-01

Applicant: Google LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N5/225 ,  H04N7/18 ,  H05K7/20

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

公开(公告)号：US11353158B2

公开(公告)日：2022-06-07

申请号：US17328501

申请日：2021-05-24

Applicant: Google LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: H04N5/225 ,  F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N7/18 ,  H05K7/20 ,  F16M11/04 ,  F16M11/06 ,  A47B97/00 ,  G03B17/56 ,  F21V21/30 ,  F21V21/088 ,  F16M11/38

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

公开(公告)号：US11035517B2

公开(公告)日：2021-06-15

申请号：US16903049

申请日：2020-06-16

Applicant: GOOGLE LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: H04N5/225 ,  F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N7/18 ,  H05K7/20 ,  F16M11/04 ,  F16M11/06 ,  A47B97/00 ,  G03B17/56 ,  F21V21/30 ,  F21V21/088 ,  F16M11/38

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

公开(公告)号：US11680677B2

公开(公告)日：2023-06-20

申请号：US17657733

申请日：2022-04-01

Applicant: Google LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: H04N5/225 ,  F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  H04N23/51 ,  G03B17/55 ,  H04N7/18 ,  H05K7/20 ,  F16M11/04 ,  F16M11/06 ,  A47B97/00 ,  G03B17/56 ,  F21V21/30 ,  F21V21/088 ,  F16M11/38 ,  H04N23/55

CPC classification number: F16M11/2035 ,  F16M11/105 ,  F16M11/14 ,  F16M13/00 ,  F16M13/005 ,  F16M13/02 ,  F16M13/022 ,  G03B17/08 ,  G03B17/55 ,  H04N7/181 ,  H04N23/51 ,  H05K7/20445 ,  A47B2097/003 ,  F16M11/041 ,  F16M11/06 ,  F16M11/2007 ,  F16M11/2064 ,  F16M11/38 ,  F21V21/088 ,  F21V21/30 ,  G03B17/561 ,  H04N23/55

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

公开(公告)号：US20210278030A1

公开(公告)日：2021-09-09

申请号：US17328501

申请日：2021-05-24

Applicant: Google LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N5/225 ,  H04N7/18 ,  H05K7/20

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

公开(公告)号：US20200332947A1

公开(公告)日：2020-10-22

申请号：US16903049

申请日：2020-06-16

Applicant: GOOGLE LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N5/225 ,  H04N7/18 ,  H05K7/20

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

公开(公告)号：US10683962B2

公开(公告)日：2020-06-16

申请号：US15607387

申请日：2017-05-26

Applicant: GOOGLE LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: H04N5/225 ,  F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N7/18 ,  H05K7/20 ,  F16M11/04 ,  F16M11/06 ,  A47B97/00 ,  G03B17/56 ,  F21V21/30 ,  F21V21/088 ,  F16M11/38

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.