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公开(公告)号:US4190310A
公开(公告)日:1980-02-26
申请号:US892522
申请日:1978-04-03
IPC分类号: H01R13/639 , H01L23/32 , H01R13/633 , H01R13/62
CPC分类号: H01R13/633
摘要: The present invention relates to a device for ejecting an electronic package from a connector. More particularly, the device includes a flat spring member adapted to be arched upwardly to push a electronic package out of engagement from the connector.
摘要翻译: 本发明涉及一种从连接器上弹出电子包装件的装置。 更具体地,该装置包括适于向上拱起以将电子组件从连接器脱离接合的扁平弹簧构件。
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公开(公告)号:US4262986A
公开(公告)日:1981-04-21
申请号:US75292
申请日:1979-09-12
CPC分类号: H01R12/714 , H01R4/02 , H01R4/14
摘要: The present invention relates to an interconnect device to provide electrical connections between printed circuit boards or a supported flexible circuit board and a wire wrap connection or solder tail connection or the like. More specifically the preferred embodiment of the invention includes a device, stamped and formed from a coplanar strip of conductive material and having a double thickness leg on top of which is an elongated spring arm formed into a rectangular shape to reduce the height it occupies in a housing while providing high spring force. Additionally, stress-distribution means is incorporated into the device.
摘要翻译: 本发明涉及一种用于提供印刷电路板或支撑的柔性电路板之间的电连接以及线缠绕连接或焊尾连接等的互连装置。 更具体地说,本发明的优选实施例包括一个冲压并由共面的导电材料条形成的装置,并且具有双层厚度的腿,其上面是细长的弹簧臂,形成为矩形形状,以减小它在一个 同时提供高弹簧力。 此外,应力分布装置被并入设备中。
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公开(公告)号:US4199209A
公开(公告)日:1980-04-22
申请号:US935042
申请日:1978-08-18
CPC分类号: H01R12/714 , H01L2924/00013 , H01R13/2428 , H01R31/00
摘要: The present invention relates to a device for electrically interconnecting two printed circuit boards or the like where the conductive pads are on extremely close spacing. More particularly, the invention includes a plurality of resilient connectors embedded in an elastomeric material with opposing ends thereof being exposed on opposite surfaces of the elastomeric body to provide contact points.
摘要翻译: 本发明涉及一种用于电连接两个印刷电路板等的装置,其中导电焊盘的间隔非常小。 更具体地,本发明包括嵌入弹性体材料中的多个弹性连接器,其相对端部暴露在弹性体的相对表面上以提供接触点。
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公开(公告)号:US4341433A
公开(公告)日:1982-07-27
申请号:US147766
申请日:1980-05-08
CPC分类号: H05K7/1069
摘要: The present invention relates to a connector of the type for electrically connecting an active device substrate unit for a PCB (printed circuit board). More particularly, the invention includes a dual-contact spring member having a buffer section so that forces exerted on one contact are not transmitted to the other contact.
摘要翻译: 本发明涉及一种用于电连接用于PCB(印刷电路板)的有源器件基板单元的连接器。 更具体地,本发明包括具有缓冲部分的双接触弹簧部件,使得施加在一个接触件上的力不传递到另一接触件。
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公开(公告)号:US4161346A
公开(公告)日:1979-07-17
申请号:US935839
申请日:1978-08-22
CPC分类号: H01R12/714 , H01R31/00
摘要: The present invention relates to a connecting element of the type for interconnecting electrical circuits on two electronic component-carrying devices such as printed circuit boards and substrate devices. More particularly the invention discloses a connecting element having a symmetrical, sinuous shape so as to provide a spring section for exerting a determined contact force. Further, the connecting element has, as an integral part thereof, a shorting beam to provide a shorter electrical path and to provide a spring means to hold the element in a housing.
摘要翻译: {PG,1]本发明涉及用于在诸如印刷电路板和基板装置的两个电子元件承载装置上互连电路的类型的连接元件。 更具体地,本发明公开了一种具有对称的,弯曲形状的连接元件,以便提供用于施加确定的接触力的弹簧部分。 此外,连接元件作为其整体部分具有短路梁以提供较短的电路径并且提供将元件保持在壳体中的弹簧装置。
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公开(公告)号:US4228604A
公开(公告)日:1980-10-21
申请号:US949887
申请日:1978-10-10
申请人: Gabriel B. Cherian
发明人: Gabriel B. Cherian
摘要: A biorhythmic cycle indicator having three, sine-wave-contoured plates that slidingly overlay a backing plate that has a calendar strip. The plate contours and the calendar register to provide a graphic representation of a person's biorhythmic cycle.The contours of the sliding plates are illuminated to accent the component cycles.
摘要翻译: 一种生物节律性循环指示器,具有三个正弦波波形板,其滑动地覆盖具有日历条的背板。 板轮廓和日历寄存器以提供人的生物节律循环的图形表示。 滑板的轮廓被照亮以强调组件循环。
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公开(公告)号:US4393581A
公开(公告)日:1983-07-19
申请号:US308221
申请日:1981-10-05
申请人: Gabriel B. Cherian
发明人: Gabriel B. Cherian
IPC分类号: H01L23/495 , H01R43/16 , H05K7/10 , H01R43/00
CPC分类号: H05K7/1053 , H01L23/49551 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L24/48 , H01L2924/00014 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01R12/58 , H01R43/16 , Y10T29/49121 , Y10T29/49204
摘要: The present invention relates to a chip carrier wherein the leads therefrom are formed into a closely spaced pattern. More particularly, the invention discloses the method of stamping and forming the leads to achieve a high density arrangement.
摘要翻译: 芯片载体技术领域本发明涉及一种芯片载体,其中引线形成为紧密间隔的图案。 更具体地,本发明公开了冲压和形成引线以实现高密度布置的方法。
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