公开(公告)号：US06436793B1

公开(公告)日：2002-08-20

申请号：US09749692

申请日：2000-12-28

申请人： Gary A. Kneezel ,  Daniel E. Kuhman ,  Brian T. Ormond ,  Ackerman C. John ,  Almon P. Fisher ,  Allan F. Camp ,  Lawrence H. Herko

发明人： Gary A. Kneezel ,  Daniel E. Kuhman ,  Brian T. Ormond ,  Ackerman C. John ,  Almon P. Fisher ,  Allan F. Camp ,  Lawrence H. Herko

IPC分类号： H01L2130

CPC分类号： B41J2/1635 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  H01L21/78

摘要： A method of forming a semiconductor structure from a first wafer and a second wafer. A pit or groove is formed in a lower surface of the first wafer. The lower surface of the first wafer is bonded to an upper surface of the second wafer. A groove is then formed on an upper surface of the first wafer, such that an opening is formed in the first wafer that exposes at least one alignment reference target on the upper surface of the second wafer. The bonded first wafer and second wafer is then diced using the exposed at least one alignment reference target to form a semiconductor structure.

摘要翻译： 一种从第一晶片和第二晶片形成半导体结构的方法。 在第一晶片的下表面形成凹坑或凹槽。 第一晶片的下表面结合到第二晶片的上表面。 然后在第一晶片的上表面上形成凹槽，使得在第一晶片中形成开口，该第一晶片在第二晶片的上表面上露出至少一个对准基准对象。 然后使用暴露的至少一个对准参考目标切割接合的第一晶片和第二晶片以形成半导体结构。

公开(公告)号：US08801914B2

公开(公告)日：2014-08-12

申请号：US13116186

申请日：2011-05-26

申请人： Samuel Chen ,  Allan F. Camp ,  Charles I. Levey ,  Vincent J. Andrews

发明人： Samuel Chen ,  Allan F. Camp ,  Charles I. Levey ,  Vincent J. Andrews

IPC分类号： C23C28/00 ,  C25D5/02

CPC分类号： H05K3/244 ,  C23C18/1653 ,  C25D3/62 ,  C25D5/14 ,  H05K1/11 ,  H05K2203/049

摘要： A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.

摘要翻译： 一种用于制造包括可焊接接触焊盘和耐磨连接器焊盘的印刷线路构件的方法，所述方法包括：a）提供包括层压到电介质基板上的铜箔的空白印刷布线构件; b）掩盖坯料印刷线路构件以保护铜箔的区域; c）在坯料印刷线路构件的未保护区域中去除铜，以形成包括接触垫和连接器垫的图案化印刷线路构件; d）在图案化的印刷线路构件上沉积镍涂层; e）在镍涂层上电解沉积硬金层; 以及f）在硬金层的表面上沉积钯以提高接触焊盘的粘合性，同时保持连接器焊盘的耐磨性。

公开(公告)号：US20120298517A1

公开(公告)日：2012-11-29

申请号：US13116186

申请日：2011-05-26

申请人： Samuel Chen ,  Allan F. Camp ,  Charles I. Levey ,  Vincent J. Andrews

发明人： Samuel Chen ,  Allan F. Camp ,  Charles I. Levey ,  Vincent J. Andrews

IPC分类号： C25D5/02

CPC分类号： H05K3/244 ,  C23C18/1653 ,  C25D3/62 ,  C25D5/14 ,  H05K1/11 ,  H05K2203/049

摘要： A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.

摘要翻译： 一种用于制造包括可焊接接触焊盘和耐磨连接器焊盘的印刷线路构件的方法，所述方法包括：a）提供包括层压到电介质基板上的铜箔的空白印刷布线构件; b）掩盖坯料印刷线路构件以保护铜箔的区域; c）在坯料印刷线路构件的未保护区域中去除铜，以形成包括接触垫和连接器垫的图案化印刷线路构件; d）在图案化的印刷线路构件上沉积镍涂层; e）在镍涂层上电解沉积硬金层; 以及f）在硬金层的表面上沉积钯以提高接触焊盘的粘合性，同时保持连接器焊盘的耐磨性。