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公开(公告)号：US20070075412A1
公开(公告)日：2007-04-05
申请号：US11239879
申请日：2005-09-30
申请人： Gavin Reid , Ihab Ali , Chris Ligtenberg , Ron Hopkinson , David Hardell
发明人： Gavin Reid , Ihab Ali , Chris Ligtenberg , Ron Hopkinson , David Hardell
IPC分类号： H01L23/02
CPC分类号： H05K1/021 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/1532 , H05K1/182 , H05K3/0061 , H05K2201/09072 , H05K2201/10393 , H05K2201/10734
摘要： A chip package for a computer system includes a substrate having a first region and a second region on a first surface, at least one die coupled to the first region on the first surface of the substrate and a main logic board coupled to the second region on the first surface of the substrate. By coupling the die and the main logic board on the first surface of the substrate, an overall thickness of the chip package is reduced.
摘要翻译： 一种用于计算机系统的芯片封装包括具有第一区域和第一表面上的第二区域的衬底，至少一个管芯，其耦合到衬底的第一表面上的第一区域，以及主逻辑板，其耦合到第二区域上 衬底的第一表面。 通过将管芯和主逻辑板耦合在衬底的第一表面上，芯片封装的整体厚度减小。
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公开(公告)号：US07714423B2
公开(公告)日：2010-05-11
申请号：US11239879
申请日：2005-09-30
申请人： Gavin Reid , Ihab Ali , Chris Ligtenberg , Ron Hopkinson , David Hardell
发明人： Gavin Reid , Ihab Ali , Chris Ligtenberg , Ron Hopkinson , David Hardell
IPC分类号： H01L23/02
CPC分类号： H05K1/021 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/1532 , H05K1/182 , H05K3/0061 , H05K2201/09072 , H05K2201/10393 , H05K2201/10734
摘要： A chip package for a computer system includes a substrate having a first region and a second region on a first surface, at least one die coupled to the first region on the first surface of the substrate and a main logic board coupled to the second region on the first surface of the substrate. By coupling the die and the main logic board on the first surface of the substrate, an overall thickness of the chip package is reduced.
摘要翻译： 一种用于计算机系统的芯片封装包括具有第一区域和第一表面上的第二区域的衬底，至少一个管芯，其耦合到衬底的第一表面上的第一区域，以及主逻辑板，其耦合到第二区域上 衬底的第一表面。 通过将管芯和主逻辑板耦合在衬底的第一表面上，芯片封装的整体厚度减小。
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公开(公告)号：US07190577B2
公开(公告)日：2007-03-13
申请号：US10951953
申请日：2004-09-28
申请人： Ihab Ali
发明人： Ihab Ali
IPC分类号： G06F1/20
CPC分类号： H01L23/427 , F28D15/0275 , G06F1/203 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A cooling system for a computer includes a heat spreader that is in thermal contact with at least one component in the computer, a frame casting, and at least one heat pipe coupled to the heat spreader and coupled to the frame casting for passively dissipating heat generated from the at least one component in the computer. By coupling the heat spreader to the frame casting via the at least one heat pipe, the conductive and convective heat transfer characteristics of the frame casting are utilized to provide additional passive cooling for the at least one component.
摘要翻译： 用于计算机的冷却系统包括与计算机中的至少一个部件热接触的散热器，框架铸造以及耦合到散热器并耦合到框架铸件的至少一个热管，用于被动地散发产生的热量 从计算机中的至少一个组件。 通过经由至少一个热管将散热器联接到框架铸件，框架铸件的导电和对流传热特性用于为至少一个部件提供额外的被动冷却。
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公开(公告)号：US20060067045A1
公开(公告)日：2006-03-30
申请号：US10951953
申请日：2004-09-28
申请人： Ihab Ali
发明人： Ihab Ali
IPC分类号： G06F1/20
CPC分类号： H01L23/427 , F28D15/0275 , G06F1/203 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A cooling system for a computer includes a heat spreader that is in thermal contact with at least one component in the computer, a frame casting, and at least one heat pipe coupled to the heat spreader and coupled to the frame casting for passively dissipating heat generated from the at least one component in the computer. By coupling the heat spreader to the frame casting via the at least one heat pipe, the conductive and convective heat transfer characteristics of the frame casting are utilized to provide additional passive cooling for the at least one component.
摘要翻译： 用于计算机的冷却系统包括与计算机中的至少一个部件热接触的散热器，框架铸造以及耦合到散热器并耦合到框架铸件的至少一个热管，用于被动地散发产生的热量 从计算机中的至少一个组件。 通过经由至少一个热管将散热器联接到框架铸件，框架铸件的导电和对流传热特性用于为至少一个部件提供额外的被动冷却。
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公开(公告)号：US20080043428A1
公开(公告)日：2008-02-21
申请号：US11624336
申请日：2007-01-18
申请人： Ihab Ali
发明人： Ihab Ali
IPC分类号： G06F1/20
CPC分类号： H01L23/427 , F28D15/0275 , G06F1/203 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A cooling system for a computer is provided. In one implementation, the cooling system includes a heat spreader that is in thermal contact with a heat generating component in the computer, a frame casting, and a heat pipe to passively dissipate heat generated from the heat generating component in the computer to the frame casting. The heat pipe includes a first portion that is co-planar with and in direct contact with the heat generating component, and a second portion that is in thermal contact with the frame casting.
摘要翻译： 提供了一种用于计算机的冷却系统。 在一个实施方案中，冷却系统包括散热器，该散热器与计算机中的发热部件，框架铸造和热管热接触，以将计算机中产生的发热部件产生的热量消散到框架铸造 。 热管包括与发热部件共平面且与发热部件直接接触的第一部分和与框架铸件热接触的第二部分。
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公开(公告)号：US07573714B2
公开(公告)日：2009-08-11
申请号：US11624336
申请日：2007-01-18
申请人： Ihab Ali
发明人： Ihab Ali
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , G06F1/203 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A cooling system for a computer is provided. In one implementation, the cooling system includes a heat spreader that is in thermal contact with a heat generating component in the computer, a frame casting, and a heat pipe to passively dissipate heat generated from the heat generating component in the computer to the frame casting. The heat pipe includes a first portion that is co-planar with and in direct contact with the heat generating component, and a second portion that is in thermal contact with the frame casting.
摘要翻译： 提供了一种用于计算机的冷却系统。 在一个实施方案中，冷却系统包括散热器，该散热器与计算机中的发热部件，框架铸造和热管热接触，以将计算机中产生的发热部件产生的热量消散到框架铸造 。 热管包括与发热部件共平面且与发热部件直接接触的第一部分和与框架铸件热接触的第二部分。
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