公开(公告)号：US08940582B2

公开(公告)日：2015-01-27

申请号：US13969965

申请日：2013-08-19

Applicant: General Electric Company

Inventor： James Sabatini ,  Christopher James Kapusta ,  Glenn Forman

IPC: H01L21/56

CPC classification number: H01L25/50 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.

Abstract translation: 电子封装包括具有第一表面的第一层，第一层包括具有第一电节点的第一器件和与第一电节点电连通且位于第一表面内的第一接触焊盘。 封装包括具有第二表面和第三表面的第二层，第二层包括位于第二表面内的第一导体和位于第三表面内且与第一导体电连通的第二接触垫。 第一各向异性导电膏（ACP）位于第一接触焊盘和第一导体之间，以将第一接触焊盘电连接到第一导体，使得电信号可以在其间通过。

公开(公告)号：US11309304B2

公开(公告)日：2022-04-19

申请号：US15956231

申请日：2018-04-18

Applicant: General Electric Company

Inventor： James Sabatini ,  Christopher James Kapusta ,  Glenn Forman

IPC: H01L25/00 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/16

Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.

公开(公告)号：US20180271372A1

公开(公告)日：2018-09-27

申请号：US15897964

申请日：2018-02-15

Applicant: General Electric Company

Inventor： Warren Lee ,  Eric William Fiveland ,  David Andrew Shoudy ,  Timothy Fiorillo ,  Kwok Pong Chan ,  Lowell Scott Smith ,  James Sabatini ,  David Martin Mills ,  Thomas Kwok-Fah Foo

IPC: A61B5/00 ,  A61B5/06 ,  A61B8/00

CPC classification number: A61B5/0035 ,  A61B5/055 ,  A61B5/066 ,  A61B8/085 ,  A61B8/4416 ,  A61B8/4444 ,  A61B8/5261 ,  A61B8/5276 ,  A61B2562/182

Abstract: An ultrasound probe configured for use in a multi-modality imaging system includes a body including one or more electrical components of the ultrasound probe, an outermost housing enclosing the ultrasound probe, and an electromagnetic interference (EMI) shield disposed between the body and the housing, wherein the EMI shield is configured to reduce interference between the ultrasound probe and one or more different imaging systems of the multi-modality imaging system. The ultrasound probe further includes a transducer disposed on a patient-facing surface of the ultrasound probe and a cable coupled to the body and configured to communicatively couple the ultrasound probe to an ultrasound imaging system of the multi-modality imaging system, wherein the ultrasound probe comprises substantially non-ferromagnetic material.

公开(公告)号：US20130344653A1

公开(公告)日：2013-12-26

申请号：US13969965

申请日：2013-08-19

Applicant: General Electric Company

Inventor： James Sabatini ,  Christopher James Kapusta ,  Glenn Forman

IPC: H01L25/00

CPC classification number: H01L25/50 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.

Abstract translation: 电子封装包括具有第一表面的第一层，第一层包括具有第一电节点的第一器件和与第一电节点电连通且位于第一表面内的第一接触焊盘。 封装包括具有第二表面和第三表面的第二层，第二层包括位于第二表面内的第一导体和位于第三表面内且与第一导体电连通的第二接触垫。 第一各向异性导电膏（ACP）位于第一接触焊盘和第一导体之间，以将第一接触焊盘电连接到第一导体，使得电信号可以在其间通过。

公开(公告)号：USRE47651E1

公开(公告)日：2019-10-15

申请号：US15415549

申请日：2017-01-25

Applicant: General Electric Company

Inventor： James Sabatini ,  Christopher James Kapusta ,  Glenn Forman

IPC: H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H01L23/538 ,  H01L25/16

Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.

公开(公告)号：US20180240789A1

公开(公告)日：2018-08-23

申请号：US15956231

申请日：2018-04-18

Applicant: General Electric Company

Inventor： James Sabatini ,  Christopher James Kapusta ,  Glenn Forman

IPC: H01L25/00 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.