公开(公告)号：US11993064B2

公开(公告)日：2024-05-28

申请号：US17797347

申请日：2021-01-26

Applicant: Georg Fritzmeier GmbH & Co. KG

Inventor： Stephan Fraunhofer

IPC: B32B37/10 ,  B32B7/12 ,  H01M50/164 ,  B32B3/30 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  B32B19/06

CPC classification number: B32B37/10 ,  B32B7/12 ,  H01M50/164 ,  B32B3/30 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  B32B19/06 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/3065 ,  B32B2311/24 ,  B32B2315/10 ,  B32B2435/00 ,  H01M2220/20

Abstract: The invention relates to a cover structure the SMC main body of which is simultaneously pressed and bonded with two additional layers in a bonding press.