Integrated circuit handler heating and singulation apparatus
    7.
    发明授权
    Integrated circuit handler heating and singulation apparatus 失效
    集成电路处理器加热和分离设备

    公开(公告)号:US4579527A

    公开(公告)日:1986-04-01

    申请号:US688027

    申请日:1984-12-31

    CPC分类号: G01R31/2867 G01R31/00

    摘要: The present invention is a device for bringing integrated circuit devices (22), to be tested at a test site, to a temperature to which the devices (22) will be subjected during operating conditions of equipments in which they will ultimately be installed. The device includes a rack (30) comprising a plurality of rails (32) overlying corresponding tracks (24) down which the integrated circuits (22) move through a magazine (20). The rails (32) are adjustable toward and away from their corresponding tracks (24), and both are heated in order to impart thermal energy to integrated circuit devices (22) passing down the tracks (24). Each track (24) has, proximate a lower end thereof, a singulation assembly (56) which not only isolates a single device (22) to be passed to a test site, but also functions to press the lowermost device (22) in a string passing down the respective track (24) into close engagement with the track (24) in order to effect maximum heat transfer.

    摘要翻译: 本发明是一种将在试验现场进行试验的集成电路装置(22)的设备带到设备(22)将最终安装在设备的操作条件下将受到的温度的装置。 该装置包括一个齿条(30),该齿条(30)包括覆盖相应的轨道(24)的多个轨道(32),集成电路(22)移动通过盒子(20)。 轨道(32)可以朝向和远离其对应的轨道(24)调节,并且两者都被加热,以便向通过轨道(24)的集成电路装置(22)赋予热能。 每个轨道(24)在其下端附近具有单独组件(56),其不仅隔离要传递到测试位置的单个设备(22),而且还用于将最下面的设备(22)按压在测试位置 弦线通过相应的轨道(24)与轨道(24)紧密接合,以便实现最大的热传递。