摘要:
A nanostructure die with a concavely curved nanostructured die surface for seamless embossing of at least one peripheral ring of a jacket surface of an embossing roll in a step-and-repeat process and an embossing roll for continuous embossing of nanostructures with an embossing layer, which has been applied on a body of revolution, with a jacket surface with at least one peripheral ring which is made seamless at least in the peripheral direction and which is embossed in the step-and-repeat process. Furthermore, the invention relates to a method and a device for producing such an embossing roll for continuous embossing of nanostructures as well as a method for producing such a nanostructure die and a method for producing an embossing substrate.
摘要:
A nanostructure die with a concavely curved nanostructured die surface for seamless embossing of at least one peripheral ring of a jacket surface of an embossing roll in a step-and-repeat process and an embossing roll for continuous embossing of nanostructures with an embossing layer, which has been applied on a body of revolution, with a jacket surface with at least one peripheral ring which is made seamless at least in the peripheral direction and which is embossed in the step-and-repeat process. Furthermore, the invention relates to a method and a device for producing such an embossing roll for continuous embossing of nanostructures as well as a method for producing such a nanostructure die and a method for producing an embossing substrate.
摘要:
A device for producing individually coded read patterns, especially resonators for use in RFID chips. The device includes a structuring apparatus for producing a basic pattern with at least one group of individual patters on a carrier substrate, and a processing apparatus for forming at least one individually coded read pattern at a time with read elements from a subset of a total set of the individual patters of each group. The invention also relates to a corresponding method and a read structure, produced according to the described method and/or the described device.
摘要:
This invention relates to a transport foil/film as well as a transport system for holding and transport of at least one thin flexible substrate and a corresponding method and a use of a flexible transport foil/film for holding and for transport of at least one thin, flexible substrate, the substrates being able to be fixed or being fixed at least temporarily on the transport foil/film and the transport foil/film being drivable by driving means for transport of the substrates.
摘要:
A device for producing individually coded read patterns, especially resonators for use in RFID chips. The device includes a structuring apparatus for producing a basic pattern with at least one group of individual patterns on a carrier substrate, and a processing apparatus for forming at least one individually coded read pattern flat a time with read elements from a subset of a total set of the individual patterns of each group. The invention also relates to a corresponding method and a read structure, produced according to the described method and/or the described device.
摘要:
This invention relates to a transport foil/film as well as a transport system for holding and transport of at least one thin flexible substrate and a corresponding method and a use of a flexible transport foil/film for holding and for transport of at least one thin, flexible substrate, the substrates being able to be fixed or being fixed at least temporarily on the transport foil/film and the transport foil/film being drivable by driving means for transport of the substrates.
摘要:
A system for transferring a nanostructure from a die to a flat side of a large-area substrate. The system has a substrate holder that receives the substrate on a substrate receiving surface. A structural surface of the die is oriented parallel to and opposite the substrate receiving surface. An adjusting means receives the substrate holder and adjusts the position of the substrate relative to the die in an x-direction, y-direction and a rotational direction. An actuator device includes at least two separately controllable actuators that each independently imposes a force in a direction orthogonal to the substrate receiving surface. A force measuring cell is in each actuator for measuring the force applied on the die or substrate. The forces, in combination, produce a single, controllable resultant force at a predetermined location. The single, resultant force is orientated in a direction orthogonal to the substrate receiving surface of the substrate holder.
摘要:
The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of: at least one receiving means for holding the substrate in a working space, a calibration means located at least partially in the working space for calibration of the substrate, an embossing means which is located at least partially in the working space for embossing of the structure material onto the substrate in an embossing process, the working space being exposed to a defined atmosphere before and during the embossing process without interruption, and a method for embossing of substrates.
摘要:
The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of: at least one receiving means for holding the substrate in a working space, a calibration means located at least partially in the working space for calibration of the substrate, an embossing means which is located at least partially in the working space for embossing of the structure material onto the substrate in an embossing process, the working space being exposed to a defined atmosphere before and during the embossing process without interruption, and a method for embossing of substrates.
摘要:
The invention relates to a system for transferring a nanostructure from a die to a flat side of a large-area substrate with a substrate holder that receives the substrate on a substrate receiving surface, and an actuator device that can be oriented parallel to the substrate receiving surface and opposite to this movable structural surface of the die and that acts orthogonally to the substrate receiving surface. To be able to use reasonably priced dies and in this case to achieve the highest possible throughput, a good edge yield, and a homogeneous structure with the substrate as much as possible without scrapping, a system is proposed with which the resultant force that acts through the die on the substrate surface can be shifted along the die surface.