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公开(公告)号：US08763239B2
公开(公告)日：2014-07-01
申请号：US12266630
申请日：2008-11-07
CPC分类号： B29C59/022 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002 , Y10T29/49124 , Y10T29/49815 , Y10T29/49895 , Y10T29/5313 , Y10T29/5317 , Y10T29/53265 , Y10T156/107
摘要： A system for transferring a nanostructure from a die to a flat side of a large-area substrate. The system has a substrate holder that receives the substrate on a substrate receiving surface. A structural surface of the die is oriented parallel to and opposite the substrate receiving surface. An adjusting means receives the substrate holder and adjusts the position of the substrate relative to the die in an x-direction, y-direction and a rotational direction. An actuator device includes at least two separately controllable actuators that each independently imposes a force in a direction orthogonal to the substrate receiving surface. A force measuring cell is in each actuator for measuring the force applied on the die or substrate. The forces, in combination, produce a single, controllable resultant force at a predetermined location. The single, resultant force is orientated in a direction orthogonal to the substrate receiving surface of the substrate holder.
摘要翻译： 用于将纳米结构从模具转移到大面积基板的平坦侧的系统。 该系统具有在衬底接收表面上接收衬底的衬底保持器。 模具的结构表面平行于衬底接收表面并与衬底接收表面相对。 调节装置接收衬底保持器并且在x方向，y方向和旋转方向上调整衬底相对于管芯的位置。 致动器装置包括至少两个单独可控制的致动器，每个致动器在与基板接收表面正交的方向上独立地施加力。 力测量单元位于每个致动器中，用于测量施加在模具或基板上的力。 这些力组合在一个预定的位置产生一个可控的合力。 单个合成力在与基板保持器的基板接收表面正交的方向上取向。
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公开(公告)号：US20110045185A1
公开(公告)日：2011-02-24
申请号：US12858509
申请日：2010-08-18
CPC分类号： B29C59/026 , B29C59/022 , B29C71/04 , B29C2059/023 , B29K2105/24 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of: at least one receiving means for holding the substrate in a working space, a calibration means located at least partially in the working space for calibration of the substrate, an embossing means which is located at least partially in the working space for embossing of the structure material onto the substrate in an embossing process, the working space being exposed to a defined atmosphere before and during the embossing process without interruption, and a method for embossing of substrates.
摘要翻译： 本发明涉及一种用于压花衬底，特别是半导体衬底或晶片的装置，包括：用于将衬底保持在工作空间中的至少一个接收装置，至少部分地位于工作空间中用于校准衬底的校准装置 至少部分地位于所述工作空间中的压花装置，用于在压花过程中将所述结构材料压花到所述基材上，所述工作空间在压花过程之前和期间暴露于限定的气氛下，而不中断;以及一种方法， 基材压花。
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公开(公告)号：US09116424B2
公开(公告)日：2015-08-25
申请号：US12858509
申请日：2010-08-18
CPC分类号： B29C59/026 , B29C59/022 , B29C71/04 , B29C2059/023 , B29K2105/24 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of: at least one receiving means for holding the substrate in a working space, a calibration means located at least partially in the working space for calibration of the substrate, an embossing means which is located at least partially in the working space for embossing of the structure material onto the substrate in an embossing process, the working space being exposed to a defined atmosphere before and during the embossing process without interruption, and a method for embossing of substrates.
摘要翻译： 本发明涉及一种用于压花衬底，特别是半导体衬底或晶片的装置，包括：用于将衬底保持在工作空间中的至少一个接收装置，至少部分地位于工作空间中用于校准衬底的校准装置 至少部分地位于所述工作空间中的压花装置，用于在压花过程中将所述结构材料压花到所述基材上，所述工作空间在压花过程之前和期间暴露于限定的气氛下，而不中断;以及一种方法， 基材压花。
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公开(公告)号：US20090151154A1
公开(公告)日：2009-06-18
申请号：US12266630
申请日：2008-11-07
IPC分类号： H05K3/00
CPC分类号： B29C59/022 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002 , Y10T29/49124 , Y10T29/49815 , Y10T29/49895 , Y10T29/5313 , Y10T29/5317 , Y10T29/53265 , Y10T156/107
摘要： The invention relates to a system for transferring a nanostructure from a die to a flat side of a large-area substrate with a substrate holder that receives the substrate on a substrate receiving surface, and an actuator device that can be oriented parallel to the substrate receiving surface and opposite to this movable structural surface of the die and that acts orthogonally to the substrate receiving surface. To be able to use reasonably priced dies and in this case to achieve the highest possible throughput, a good edge yield, and a homogeneous structure with the substrate as much as possible without scrapping, a system is proposed with which the resultant force that acts through the die on the substrate surface can be shifted along the die surface.
摘要翻译： 本发明涉及一种用于将纳米结构从模具转移到大面积基板的平坦侧的系统，该基板保持器在基板接收表面上容纳基板，并且致动器装置可以平行于基板接收 表面并与模具的该可移动结构表面相对并且与基板接收表面正交地作用。 为了能够使用价格合理的模具，并且在这种情况下，尽可能实现最高的吞吐量，良好的边缘屈服度，以及尽可能不消除基底的均匀的结构，提出了一种系统， 衬底表面上的管芯可以沿模具表面移动。
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公开(公告)号：US20120241098A1
公开(公告)日：2012-09-27
申请号：US13265035
申请日：2010-03-31
IPC分类号： B32B38/10
CPC分类号： B32B38/10 , B32B43/006 , H01L21/67092 , H01L21/67132 , Y10T156/1105 , Y10T156/1168 , Y10T156/1189 , Y10T156/19 , Y10T156/1906 , Y10T156/1972
摘要： Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.
摘要翻译： 用于通过互连层与基板连接的载体基板分离基板的装置。 该装置包括具有用于保持载体衬底的保持表面的载体衬底保持器和与载体衬底保持器相对定位的衬底保持器，衬底保持表面可平行于容纳衬底的保持表面定位。 在衬底和载体衬底的互连状态下，存在用于平行移动衬底相对于载体衬底的分离装置。
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公开(公告)号：US08449716B2
公开(公告)日：2013-05-28
申请号：US13265035
申请日：2010-03-31
IPC分类号： B32B38/00
CPC分类号： B32B38/10 , B32B43/006 , H01L21/67092 , H01L21/67132 , Y10T156/1105 , Y10T156/1168 , Y10T156/1189 , Y10T156/19 , Y10T156/1906 , Y10T156/1972
摘要： Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.
摘要翻译： 用于通过互连层与基板连接的载体基板分离基板的装置。 该装置包括具有用于保持载体衬底的保持表面的载体衬底保持器和与载体衬底保持器相对定位的衬底保持器，衬底保持表面可平行于容纳衬底的保持表面定位。 在衬底和载体衬底的互连状态下，存在用于平行移动衬底相对于载体衬底的分离装置。
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公开(公告)号：US08931624B2
公开(公告)日：2015-01-13
申请号：US12944867
申请日：2010-11-12
CPC分类号： B65H37/002
摘要： This invention relates to a transport foil/film as well as a transport system for holding and transport of at least one thin flexible substrate and a corresponding method and a use of a flexible transport foil/film for holding and for transport of at least one thin, flexible substrate, the substrates being able to be fixed or being fixed at least temporarily on the transport foil/film and the transport foil/film being drivable by driving means for transport of the substrates.
摘要翻译： 本发明涉及一种输送箔/膜以及用于保持和输送至少一个薄柔性基板的输送系统，以及相应的方法以及用于保持和运输至少一个薄的柔性输送箔/膜的使用 柔性基板，基板能够固定或至少暂时固定在输送箔/膜上，并且运输箔/薄膜可通过用于输送基板的驱动装置驱动。
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8.发明授权公开(公告)号：US08828147B2
公开(公告)日：2014-09-09
申请号：US13078110
申请日：2011-04-01
CPC分类号： H01L21/6708 , H01L21/67109
摘要： The invention relates to a device for loosening a polymer layer from a surface of a substrate.
摘要翻译： 本发明涉及一种用于从基材表面松动聚合物层的装置。
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公开(公告)号：US09272501B2
公开(公告)日：2016-03-01
申请号：US13641479
申请日：2011-03-29
CPC分类号： B32B38/10 , B32B37/025 , B32B43/006 , B32B2038/0052 , B32B2307/546 , B32B2310/0418 , H01L21/67092 , H01L21/67132 , H01L21/6715 , H01L21/67346 , H01L21/68721 , H01L21/68771 , H01L2221/68386 , Y10T156/1111 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1922 , Y10T156/1928 , Y10T156/1978 , Y10T156/1983
摘要： Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.
摘要翻译： 用于通过胶片框架通过粘合层将产品基板从连接到产品基板的载体基板上剥离的装置，连接到膜框架的柔性膜，并且具有用于将产品基板保持在接触中的粘合剂层 膜的表面部分，薄膜在包围接触表面部分的薄膜的连接部分中连接到薄膜框架，以及由薄膜框架和薄膜形成的特别是可变体积的溶剂容器，用于保持 用于分离粘合层的溶剂以及产物基质和粘合层可以容纳在溶剂储存器中，以及通过用于将溶剂输送到溶剂储存器中的输送装置和用于将载体基材从载体基材上剥离的剥离装置。
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公开(公告)号：US20130240113A1
公开(公告)日：2013-09-19
申请号：US13878570
申请日：2011-10-05
IPC分类号： H01L21/02
CPC分类号： B65G47/00 , H01L21/02002 , H01L21/67173 , H01L21/67201 , Y10T156/10
摘要： The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
摘要翻译： 本发明涉及一种用于使用至少一个预处理模块，至少一个后处理模块和至少一个主处理模块来处理衬底，特别是晶片的装置，并且预处理模块和后处理模块可以切换为用于 初级处理模块，以及用于处理基板，特别是晶片的相应方法。
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