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    EAS system providing synchronized transmission
    5.
    发明授权
    EAS system providing synchronized transmission 有权
    EAS系统提供同步传输

    公开(公告)号：US08058994B2

    公开(公告)日：2011-11-15

    申请号：US11991689

    申请日：2005-09-09

    申请人： Gerardo Aguirre ,  Douglas A. Drew

    发明人： Gerardo Aguirre ,  Douglas A. Drew

    IPC分类号： G08B13/14

    CPC分类号： G08B13/2488

    摘要： A system and method for providing synchronized transmission in an electronic article surveillance (EAS) system is provided. The method includes determining a transmission timing difference between a plurality of units of the EAS system using a communication link of the EAS system and synchronizing transmissions for each of the plurality of units based on the transmission timing difference.

    摘要翻译： 提供了一种用于在电子物品监视（EAS）系统中提供同步传输的系统和方法。 该方法包括使用EAS系统的通信链路来确定EAS系统的多个单元之间的传输定时差异，并且基于传输定时差来同步多个单元中的每个单元的传输。

    Eas System Providing Synchronized Transmission
    6.
    发明申请
    Eas System Providing Synchronized Transmission 有权
    Eas系统提供同步传输

    公开(公告)号：US20090051534A1

    公开(公告)日：2009-02-26

    申请号：US11991689

    申请日：2005-09-09

    申请人： Gerardo Aguirre ,  Douglas A. Drew

    发明人： Gerardo Aguirre ,  Douglas A. Drew

    IPC分类号： G08B13/14

    CPC分类号： G08B13/2488

    摘要： A system and method for providing synchronized transmission in an electronic article surveillance (EAS) system is provided. The method includes determining a transmission timing difference between a plurality of units of the EAS system using a communication link of the EAS system and synchronizing transmissions for each of the plurality of units based on the transmission timing difference.

    摘要翻译： 提供了一种用于在电子物品监视（EAS）系统中提供同步传输的系统和方法。 该方法包括使用EAS系统的通信链路来确定EAS系统的多个单元之间的传输定时差异，并且基于传输定时差来同步多个单元中的每个单元的传输。

    IMPEDENCE MATCHING ALONG VERTICLE PATH OF MICROWAVE VIAS IN MULTILAYER PACKAGES
    7.
    发明申请
    IMPEDENCE MATCHING ALONG VERTICLE PATH OF MICROWAVE VIAS IN MULTILAYER PACKAGES 有权
    MICROWAVE VIAS在多层包装中的垂直路径的影响匹配

    公开(公告)号：US20060038633A1

    公开(公告)日：2006-02-23

    申请号：US10925377

    申请日：2004-08-23

    申请人： Gerardo Aguirre ,  Christopher Gordon

    发明人： Gerardo Aguirre ,  Christopher Gordon

    IPC分类号： H01P5/02

    CPC分类号： H01P5/02 ,  H01L2924/15311 ,  H01P1/047

    摘要： High frequency matching in a multilayer ceramic package is accomplished by a radial stub arrangement provided in one or more of the ground planes of a stack of layers forming the package. A signal via extends vertically upwardly between a ball grid array at a bottom surface of the stack and a coplanar waveguide in the form of a signal trace on a top surface of the stack. Each radial stub arrangement surrounds the signal via and is formed by a central space in the ground plane which surrounds the via and a plurality of stub-forming spaces in the ground plane which extend radially outwardly from the central space. The stub-forming spaces form a plurality of radial stubs which extends inwardly from the ground plane to locations adjacent but spaced apart from the signal via. The discontinuities provided by the spaces behave as a shunt inductance connected to a series capacitance. The radial stub arrangements provide high frequency matching in an arrangement which is confined to the vertical path of the signal via, thereby enabling higher interconnect density in multilayer packages.

    摘要翻译： 多层陶瓷封装中的高频匹配通过在形成封装的一叠层的一个或多个接地平面中提供的径向短截线布置来实现。 信号通道在堆叠的底表面处的球栅阵列之间垂直向上延伸，并且在堆叠的顶表面上以信号迹线的形式形成共面波导。 每个径向短截线排列围绕信号通孔，并且由接地平面中的中心空间形成，该中心空间围绕通孔以及在接地平面中的多个从中心空间径向向外延伸的短截线形成空间。 短截线形成空间形成从接地平面向内延伸到与信号通孔相邻但间隔开的位置的多个径向短截线。 由空间提供的不连续性表现为连接到串联电容的并联电感。 径向短截线布置在限制在信号通孔的垂直路径上的布置中提供高频匹配，从而使多层封装中的互连密度更高。

    Impedence matching along verticle path of microwave vias in multilayer packages
    9.
    发明授权
    Impedence matching along verticle path of microwave vias in multilayer packages 有权
    多层封装中微波通孔沿垂直路径的阻抗匹配

    公开(公告)号：US07053729B2

    公开(公告)日：2006-05-30

    申请号：US10925377

    申请日：2004-08-23

    申请人： Gerardo Aguirre ,  Christopher Gordon

    发明人： Gerardo Aguirre ,  Christopher Gordon

    IPC分类号： H01P3/08 ,  H05K1/18

    CPC分类号： H01P5/02 ,  H01L2924/15311 ,  H01P1/047

    摘要： High frequency matching in a multilayer ceramic package is accomplished by a radial stub arrangement provided in one or more of the ground planes of a stack of layers forming the package. A signal via extends vertically upwardly between a ball grid array at a bottom surface of the stack and a coplanar waveguide in the form of a signal trace on a top surface of the stack. Each radial stub arrangement surrounds the signal via and is formed by a central space in the ground plane which surrounds the via and a plurality of stub-forming spaces in the ground plane which extend radially outwardly from the central space. The stub-forming spaces form a plurality of radial stubs which extends inwardly from the ground plane to locations adjacent but spaced apart from the signal via. The discontinuities provided by the spaces behave as a shunt inductance connected to a series capacitance. The radial stub arrangements provide high frequency matching in an arrangement which is confined to the vertical path of the signal via, thereby enabling higher interconnect density in multilayer packages.

    摘要翻译： 多层陶瓷封装中的高频匹配通过在形成封装的一叠层的一个或多个接地平面中提供的径向短截线布置来实现。 信号通道在堆叠的底表面处的球栅阵列之间垂直向上延伸，并且在堆叠的顶表面上以信号迹线的形式形成共面波导。 每个径向短截线排列围绕信号通孔，并且由接地平面中的中心空间形成，该中心空间围绕通孔以及在接地平面中的多个从中心空间径向向外延伸的短截线形成空间。 短截线形成空间形成从接地平面向内延伸到与信号通孔相邻但间隔开的位置的多个径向短截线。 由空间提供的不连续性表现为连接到串联电容的并联电感。 径向短截线布置在限制在信号通孔的垂直路径上的布置中提供高频匹配，从而使多层封装中的互连密度更高。

    Matching for ring hybrid
    10.
    发明申请
    Matching for ring hybrid 审中-公开
    匹配环混合

    公开(公告)号：US20060109063A1

    公开(公告)日：2006-05-25

    申请号：US10996931

    申请日：2004-11-23

    申请人： Gerardo Aguirre ,  Paul Garland

    发明人： Gerardo Aguirre ,  Paul Garland

    IPC分类号： H01P5/22

    CPC分类号： H01P5/222

    摘要： A ring hybrid circuit achieves broadband matching in a compact, small footprint configuration which allows all matching structures to be printed on the same surface layer as the ring hybrid. The circuit includes a power dividing ring of circular configuration and having an inner diameter. A plurality of transmission lines are coupled to the ring at ports. Each of the ports has a notch in the inner diameter of the ring opposite the transmission line at the port for providing reactance compensation. The ring is provided with four ports, with each of the ports having a notch in the inner diameter of the ring opposite an associated one of the plurality of transmission lines. The ring may be constructed of a 50 ohm line, and each of the transmission lines may include a 42 ohm quarter-wave matching section extending out from the port thereof and terminating in a 50 ohm line.

    摘要翻译： 环形混合电路在紧凑的小尺寸配置中实现宽带匹配，其允许所有匹配结构印刷在与环形混合物相同的表面层上。 该电路包括具有圆形构造并具有内径的功率分配环。 多个传输线在端口处耦合到环。 每个端口在端口的与传输线相对的内径处具有凹口，用于提供电抗补偿。 环设置有四个端口，其中每个端口具有与多个传输线中相关联的一个传输线相对的环的内径中的凹口。 环可以由50欧姆线构成，并且每个传输线可以包括从其端口延伸并终止于50欧姆线路的42欧姆四分之一波长匹配部分。