公开(公告)号：US11844173B2

公开(公告)日：2023-12-12

申请号：US17478987

申请日：2021-09-20

申请人： GigaLane Co., Ltd.

发明人： Byung-hoon Jo ,  Ik-soo Kim ,  Byung-yeol Kim ,  Hee-seok Jung

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/03

CPC分类号： H05K1/0219 ,  H05K1/028 ,  H05K1/115 ,  H05K1/024 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0393

摘要： The present disclosure provides a flexible circuit board for multiple signal transmission including a first dielectric layer; a plurality of first side grounds formed on one surface of the first dielectric layer to be parallel; first signal lines formed between the plurality of first side grounds; and a plurality of through holes which is formed in each of the plurality of first side grounds with an interval, along a length direction of the first side grounds.