ILLUMINATION APPARATUS, METHOD FOR MANUFATURING LIGHT GUIDE PLATE, BACK LIGHT MODULE AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    ILLUMINATION APPARATUS, METHOD FOR MANUFATURING LIGHT GUIDE PLATE, BACK LIGHT MODULE AND METHOD FOR MANUFACTURING THE SAME 有权
    照明装置,制造光导板的方法,背光模块及其制造方法

    公开(公告)号:US20150131323A1

    公开(公告)日:2015-05-14

    申请号:US14606031

    申请日:2015-01-27

    IPC分类号: F21V8/00 B29D11/00

    摘要: A method for manufacturing a light guide apparatus includes the following steps. A first mold and a second mold are provided. The first mold and the second mold respectively include a first molding surface and a second molding surface facing each other. A protrusion is disposed at the first or second molding surfaces. Sheet materials are provided. Each sheet material includes an opening corresponding to the protrusion, a first surface and a circuit layer disposed on the first surface. One of the sheet materials is disposed on the first mold with first surface facing the first mold. The first mold and the second mold are closed. An optical plastic material is injected into the space between the first and second molding surfaces to form a light guide plate having a via corresponding to the protrusion for embedding a light source. The sheet material is laminated on the light guide plate.

    摘要翻译: 制造导光装置的方法包括以下步骤。 提供第一模具和第二模具。 第一模具和第二模具分别包括彼此面对的第一模制表面和第二模制表面。 突起被设置在第一或第二成型表面。 提供板材。 每个片材包括对应于突起的开口,第一表面和设置在第一表面上的电路层。 其中一个片材被设置在第一模具上,第一表面面向第一模具。 第一模具和第二模具关闭。 将光学塑料材料注入到第一和第二模制表面之间的空间中以形成具有对应于用于嵌入光源的突起的通孔的导光板。 片材层压在导光板上。

    Light guide plate and assembly thereof

    公开(公告)号:US10048536B2

    公开(公告)日:2018-08-14

    申请号:US15390546

    申请日:2016-12-26

    摘要: A light guide plate and assembly thereof are disclosed. The light guide plate includes a base plate, an optical pattern on the bottom surface of the base plate, a first circuit and a second circuit on the top surface of the base plate. As a front light module, the first circuit is designed to be light penetrable at the visual area of the base plate as a touch sensing circuit, and the second circuit is surrounding and electrically connected the first circuit. The front light module achieves the thickness reduction of a mobile device having a reflective type panel. As a back light module, the first circuit and the second circuit are arranged in two adjacent blocks on the top surface of the base plate without electrically connecting to each other. The back light module may be applied to perform a local dimming technology by adapting an extra low resolution panel.

    Illumination apparatus, method for manufacturing light guide plate, back light module and method for manufacturing the same
    4.
    发明授权
    Illumination apparatus, method for manufacturing light guide plate, back light module and method for manufacturing the same 有权
    照明装置,导光板的制造方法,背光模块及其制造方法

    公开(公告)号:US09322971B2

    公开(公告)日:2016-04-26

    申请号:US14606031

    申请日:2015-01-27

    摘要: A method for manufacturing a light guide apparatus includes the following steps. A first mold and a second mold are provided. The first mold and the second mold respectively include a first molding surface and a second molding surface facing each other. A protrusion is disposed at the first or second molding surfaces. Sheet materials are provided. Each sheet material includes an opening corresponding to the protrusion, a first surface and a circuit layer disposed on the first surface. One of the sheet materials is disposed on the first mold with first surface facing the first mold. The first mold and the second mold are closed. An optical plastic material is injected into the space between the first and second molding surfaces to form a light guide plate having a via corresponding to the protrusion for embedding a light source. The sheet material is laminated on the light guide plate.

    摘要翻译: 制造导光装置的方法包括以下步骤。 提供第一模具和第二模具。 第一模具和第二模具分别包括彼此面对的第一模制表面和第二模制表面。 突起被设置在第一或第二成型表面。 提供板材。 每个片材包括对应于突起的开口,第一表面和设置在第一表面上的电路层。 其中一个片材被设置在第一模具上,第一表面面向第一模具。 第一模具和第二模具关闭。 将光学塑料材料注入到第一和第二模制表面之间的空间中以形成具有对应于用于嵌入光源的突起的通孔的导光板。 片材层压在导光板上。