公开(公告)号：US11502400B2

公开(公告)日：2022-11-15

申请号：US17319451

申请日：2021-05-13

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Selaka B. Bulumulla ,  Koushik Ramachandran ,  Benjamin V. Fasano

IPC: H01Q1/42 ,  H01Q1/50 ,  H01Q21/06

Abstract: Disclosed are embodiments of a microelectronics package that includes: first and second substrates (each having first and second sides); a chip; and a multi-element antenna connected to the chip. The chip is mounted on the first side of the first substrate. A first antenna element of the antenna is on the second side of the first substrate and electrically connected to the chip. The first side of the second substrate is adhered to the second side of the first substrate (i.e., covering the first antenna element). A second antenna element of the antenna is on the second side of the second substrate overlaying the first antenna element and physically separated therefrom by at least one ultra-low-K dielectric region within the first side of the second substrate and/or the second side of the first substrate. Optionally, the package includes multiple chips and/or multiple antennas. Also disclosed are associated method embodiments.

公开(公告)号：US20220057575A1

公开(公告)日：2022-02-24

申请号：US17453533

申请日：2021-11-04

Applicant: GlobalFoundries U.S. Inc.

Inventor： Benjamin V. Fasano ,  Andreas D. Stricker ,  Hanyi Ding ,  Yusheng Bian ,  Bo Peng

IPC: G02B6/122

Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including an absorber layer separated from an optical grating coupler by a cladding material. The absorber is positioned to receive light reoriented through the optical grating coupler.

公开(公告)号：US20210273323A1

公开(公告)日：2021-09-02

申请号：US17319451

申请日：2021-05-13

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Selaka B. Bulumulla ,  Koushik Ramachandran ,  Benjamin V. Fasano

IPC: H01Q1/42 ,  H01Q1/50

Abstract: Disclosed are embodiments of a microelectronics package that includes: first and second substrates (each having first and second sides); a chip; and a multi-element antenna connected to the chip. The chip is mounted on the first side of the first substrate. A first antenna element of the antenna is on the second side of the first substrate and electrically connected to the chip. The first side of the second substrate is adhered to the second side of the first substrate (i.e., covering the first antenna element). A second antenna element of the antenna is on the second side of the second substrate overlaying the first antenna element and physically separated therefrom by at least one ultra-low-K dielectric region within the first side of the second substrate and/or the second side of the first substrate. Optionally, the package includes multiple chips and/or multiple antennas. Also disclosed are associated method embodiments.

公开(公告)号：US20210173145A1

公开(公告)日：2021-06-10

申请号：US16703387

申请日：2019-12-04

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Benjamin V. Fasano ,  Jorge A. Lubguban ,  Sarah H. Knickerbocker ,  Tracy A. Tong

IPC: G02B6/122 ,  G02B6/12 ,  G02B6/38

Abstract: Photonic integrated circuit (PIC) packages include a PIC die. The PIC die includes a waveguide(s) positioned on the PIC die, and a groove(s) formed in a surface of the PIC die. The groove(s) corresponds to and is positioned directly adjacent the waveguide(s). The PIC package also includes an optical fiber(s) operatively coupled to the waveguide(s) of the PIC die. The optical fiber(s) are positioned in the groove(s) of the PIC die and include an end positioned adjacent the waveguide(s). Additionally, the PIC package includes a plate positioned over a section of the optical fiber(s), and the plate includes a first edge positioned adjacent the waveguide(s) of the PIC die, and a second edge positioned opposite the first edge. The PIC package also includes a first adhesive disposed along the second edge of the plate and a second adhesive disposed along the first edge of the plate.

公开(公告)号：US11204463B1

公开(公告)日：2021-12-21

申请号：US16931771

申请日：2020-07-17

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Benjamin V. Fasano ,  Andreas D. Stricker ,  Hanyi Ding ,  Yusheng Bian ,  Bo Peng

IPC: G02B6/122 ,  G02B6/12

Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including an optical medium for light signals; and an optical grating coupler coupled to the optical medium. The optical grating coupler is configured to reorient light from the optical medium. A cladding material is over the optical grating coupler. An absorber layer is over the cladding material, and vertically above the optical grating coupler.

公开(公告)号：US11075453B1

公开(公告)日：2021-07-27

申请号：US16804126

申请日：2020-02-28

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Selaka B. Bulumulla ,  Koushik Ramachandran ,  Benjamin V. Fasano

IPC: H01Q1/42 ,  H01Q1/50 ,  H01Q21/06

Abstract: Disclosed are embodiments of a microelectronics package that includes: first and second substrates (each having first and second sides); a chip; and a multi-element antenna connected to the chip. The chip is mounted on the first side of the first substrate. A first antenna element of the antenna is on the second side of the first substrate and electrically connected to the chip. The first side of the second substrate is adhered to the second side of the first substrate (i.e., covering the first antenna element). A second antenna element of the antenna is on the second side of the second substrate overlaying the first antenna element and physically separated therefrom by at least one ultra-low-K dielectric region within the first side of the second substrate and/or the second side of the first substrate. Optionally, the package includes multiple chips and/or multiple antennas. Also disclosed are associated method embodiments.

公开(公告)号：US11536900B2

公开(公告)日：2022-12-27

申请号：US17453533

申请日：2021-11-04

Applicant: GlobalFoundries U.S. Inc.

Inventor： Benjamin V. Fasano ,  Andreas D. Stricker ,  Hanyi Ding ,  Yusheng Bian ,  Bo Peng

IPC: G02B6/122 ,  G02B6/12

Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including an absorber layer separated from an optical grating coupler by a cladding material. The absorber is positioned to receive light reoriented through the optical grating coupler.