公开(公告)号：US06426636B1

公开(公告)日：2002-07-30

申请号：US09022240

申请日：1998-02-11

申请人： Gobinda Das ,  Steven J. Duda ,  Paul M. Gaschke ,  Angelo M. Giaimo ,  Frederick L. Taber, Jr. ,  John F. Vetrero

发明人： Gobinda Das ,  Steven J. Duda ,  Paul M. Gaschke ,  Angelo M. Giaimo ,  Frederick L. Taber, Jr. ,  John F. Vetrero

IPC分类号： G01R3102

CPC分类号： G01R1/0735

摘要： A nonresilient rigid test probe arrangement which is designed for testing the integrity of silicon semiconductor device wafers or chips, and which eliminates pliant conditions encountered by current text fixtures, which are adverse to the attainment of satisfactory test results with rigid probes. The test system interface assembly includes a rigid ceramic substrate which forms a pedestal over which the rigid probe makes electrical contact. A PC board is located on the opposite side of the ceramic substrate. A clamp ring retains the PC board to a test head system with mating precision reference surfaces formed therebetween. Pogo pin connectors extend between the PC board and the test head system. A stiffening element having a control aperture is bolted through the PC board to the clamp ring, all of which form a rigid test probe arrangement.

摘要翻译： 设计用于测试硅半导体器件晶片或芯片的完整性的非敏感性刚性测试探针装置，并且消除了当前文本夹具遇到的柔性条件，这对于用刚性探头达到令人满意的测试结果是不利的。 测试系统接口组件包括形成基座的刚性陶瓷基板，刚性探头在该基座上进行电接触。 PC板位于陶瓷基板的相对侧。 夹环将PC板保持在测试头系统上，其间形成有配合的精密参考表面。 Pogo针连接器在PC板和测试头系统之间延伸。 具有控制孔的加强元件通过PC板螺栓连接到夹紧环，所有这些形成刚性测试探针装置。

公开(公告)号：US5977787A

公开(公告)日：1999-11-02

申请号：US876664

申请日：1997-06-16

申请人： Gobina Das ,  Paul Mathew Gaschke ,  Suryanarayan G. Hegde ,  Mark Raymond LaForce ,  Dale Curtis McHerron ,  Charles Hampton Perry ,  Frederick L. Taber, Jr.

发明人： Gobina Das ,  Paul Mathew Gaschke ,  Suryanarayan G. Hegde ,  Mark Raymond LaForce ,  Dale Curtis McHerron ,  Charles Hampton Perry ,  Frederick L. Taber, Jr.

IPC分类号： G01R1/073

CPC分类号： G01R1/07371 ,  G01R1/07357

摘要： A multiple-chip probe assembly suitable for wafer testing over a wide temperature range includes a plurality of individual buckling beam probe elements. A support structure supports the plurality of buckling beam probe elements in an arrangement in accordance with an electrical contact footprint for use in electrically contacting multiple chips of a wafer under test and enables buckling movement in a contacting direction of the plurality of buckling beams. The support structure includes a principal support material having a thermal coefficient of expansion (TCE) matched with the wafer under test and a second material other than the principal support material, wherein a contact positioning of the plurality of buckling beam probe elements upon the wafer under test during a testing operation is maintained. The second material prevents an individual probe element from electrically contacting the principal support material.

摘要翻译： 适合于在宽温度范围内进行晶片测试的多芯片探针组件包括多个单独的屈曲束探针元件。 支撑结构根据用于电接触被测试晶片的多个芯片的电接触覆盖区布置地支撑多个屈曲梁探针元件，并且能够实现多个屈曲梁的接触方向的屈曲运动。 支撑结构包括具有与待测晶片匹配的热膨胀系数（TCE）和不同于主支撑材料的第二材料的主支撑材料，其中多个屈曲束探针元件在晶片下的接触定位 在测试操作期间进行测试。 第二材料防止单独的探针元件电接触主支撑材料。