公开(公告)号：US09142872B1

公开(公告)日：2015-09-22

申请号：US13854190

申请日：2013-04-01

Applicant: Google Inc.

Inventor： Jamal S. Izadian

IPC: H01P5/12 ,  H01P5/20 ,  H01P11/00 ,  H01P3/00

CPC classification number: H01P11/003 ,  H01P3/00 ,  H01P5/20

Abstract: Example three-dimensional signal interconnections for electromagnetic waves and methods for fabricating the interconnections are described. An example apparatus may include a first conducting layer including a plurality of through-holes, and a first layer between the first conducting layer and a second conducting layer. The first layer may include a plurality of through-holes, and the second conducting layer may also include a plurality of through-holes. The plurality of through-holes of the first layer may at least partially be aligned with the plurality of through-holes of the first conducting layer and the plurality through-holes of the second conducting layer. The apparatus may further include a second layer between the second conducting layer and a third conducting layer. The second layer may have a first waveguide channel and a second waveguide channel substantially perpendicular to and intersecting with the first waveguide channel.

Abstract translation: 描述用于电磁波的示例性三维信号互连和用于制造互连的方法。 示例性装置可以包括包括多个通孔的第一导电层和在第一导电层和第二导电层之间的第一层。 第一层可以包括多个通孔，并且第二导电层还可以包括多个通孔。 第一层的多个通孔可以至少部分地与第一导电层的多个通孔和第二导电层的多个通孔对准。 该装置还可以包括在第二导电层和第三导电层之间的第二层。 第二层可以具有基本上垂直于第一波导通道并且与第一波导通道相交的第一波导通道和第二波导通道。

公开(公告)号：US09130254B1

公开(公告)日：2015-09-08

申请号：US13851469

申请日：2013-03-27

Applicant: Google Inc.

Inventor： Jamal S. Izadian

IPC: H01P3/18 ,  H01P11/00

CPC classification number: H01P11/002 ,  H01P3/121

Abstract: Three-dimensional electromagnetic signal interconnect systems and methods for fabricating the interconnect systems are described. An example apparatus may comprise a first layer including a first dielectric layer coupled to one or more of a first and second conducting layer. The first layer may also include at least one hole. The apparatus may also comprise a second layer including at least one through-hole and a second dielectric layer coupled between a third and fourth conducting layer. The apparatus may further comprise a third layer including at least one hole and a third dielectric layer coupled to one or more of a fifth and sixth conducting layer. The at least one hole/through-hole of each layer may be aligned at least in part with the at least one hole/through-hole of each other layer, and may include metal plating coupled to an inner surface of the respective at least one hole/through-hole.

Abstract translation: 描述用于制造互连系统的三维电磁信号互连系统和方法。 示例性装置可以包括第一层，其包括耦合到第一和第二导电层中的一个或多个的第一介电层。 第一层还可以包括至少一个孔。 该装置还可以包括第二层，其包括耦合在第三和第四导电层之间的至少一个通孔和第二电介质层。 该装置还可以包括第三层，其包括耦合到第五和第六导电层中的一个或多个的至少一个孔和第三电介质层。 每个层的至少一个孔/通孔可以至少部分地与每个其他层的至少一个孔/通孔对准，并且可以包括金属电镀，其耦合到相应的至少一个的内表面 孔/通孔。

公开(公告)号：US09123979B1

公开(公告)日：2015-09-01

申请号：US13852416

申请日：2013-03-28

Applicant: Google Inc.

Inventor： Jamal S. Izadian

IPC: H01P3/18 ,  H01P3/00

CPC classification number: H01P3/18 ,  H01P1/208 ,  H01P3/121

Abstract: Example multi-layer apparatus for electromagnetic waves and methods for fabricating such apparatus are described. An example apparatus may include a first conducting layer including an input port and a second conducting layer including at least one through-hole. The apparatus may also include a first layer between the first conducting layer and the second conducting layer, including a first waveguide aligned at least in part with the input port and the at least one through-hole. The apparatus may also include a third conducting layer including an output port. The apparatus may also include a second layer between the second conducting layer and the third conducting layer, including a second waveguide aligned at least in part with the output port and the at least one through-hole. The at least one through-hole may be configured to couple millimeter electromagnetic waves from the first waveguide to the second waveguide.

Abstract translation: 描述了用于电磁波的示例性多层设备及其制造方法。 示例性装置可以包括包括输入端口的第一导电层和包括至少一个通孔的第二导电层。 该装置还可以包括在第一导电层和第二导电层之间的第一层，包括至少部分地与输入端口和至少一个通孔对准的第一波导管。 该装置还可以包括包括输出端口的第三导电层。 该装置还可以包括在第二导电层和第三导电层之间的第二层，包括至少部分地与输出端口和至少一个通孔对准的第二波导。 至少一个通孔可以被配置为将来自第一波导的毫米波电磁波耦合到第二波导。