公开(公告)号：US20220065704A1

公开(公告)日：2022-03-03

申请号：US17006472

申请日：2020-08-28

Applicant: Google LLC

Inventor： Michael Mitchell ,  Arun Raghupathy ,  William Dong ,  Adrian Shanov

IPC: G01K1/16 ,  G05D23/19 ,  G01K13/02

Abstract: A smart-home device may include a housing, a printed circuit board (PCB) inside the housing, an environmental sensor mounted to the PCB inside the housing, and a gasket that encloses the environmental sensor inside the housing to isolate the environmental sensor from an atmosphere inside of the housing while allowing an atmosphere outside of the housing to enter the gasket such that the environmental sensor can measure an aspect of the atmosphere outside of the housing.

公开(公告)号：US11761823B2

公开(公告)日：2023-09-19

申请号：US17006472

申请日：2020-08-28

Applicant: Google LLC

Inventor： Michael Mitchell ,  Arun Raghupathy ,  William Dong ,  Adrian Shanov

IPC: G01K1/16 ,  G01K13/024 ,  G05D23/19 ,  G01K13/02

CPC classification number: G01K1/16 ,  G01K13/02 ,  G05D23/1917 ,  G01K13/024

Abstract: A smart-home device may include a housing, a printed circuit board (PCB) inside the housing, an environmental sensor mounted to the PCB inside the housing, and a gasket that encloses the environmental sensor inside the housing to isolate the environmental sensor from an atmosphere inside of the housing while allowing an atmosphere outside of the housing to enter the gasket such that the environmental sensor can measure an aspect of the atmosphere outside of the housing.