Temperature sensor
    3.
    发明授权

    公开(公告)号:US11994433B2

    公开(公告)日:2024-05-28

    申请号:US17236304

    申请日:2021-04-21

    申请人: DENSO CORPORATION

    发明人: Masaki Hironaka

    摘要: The temperature sensor includes a temperature sensing element, a pair of element electrode wires, and a pair of terminals. An overlapping wire portion of each of the element electrode wires is connected to the terminal in such a manner as to overlap the terminal in an overlapping direction. A fillet portion is disposed on a side surface of the overlapping wire portion. The fillet portion has a pair of fillet pieces formed in such a manner as to crawl up from a specific main surface that is a main surface at the overlapping wire portion side in the terminal. In a cross section of the temperature sensor orthogonal to a sensor axis direction and passing through the fillet portion, the maximum length in a width direction of the fillet portion is defined as a fillet maximum width A, and a length in a width direction between a pair of boundary portions between the pair of fillet pieces and the specific main surface is defined as a boundary width B. The temperature sensor has, at least partly in the sensor axis direction, a specific cross section satisfying B≤A, as a cross section of the temperature sensor orthogonal to the sensor axis direction and passing through the fillet portion.

    INSTALLATION STRUCTURE OF SENSOR
    7.
    发明公开

    公开(公告)号:US20240068877A1

    公开(公告)日:2024-02-29

    申请号:US18237142

    申请日:2023-08-23

    IPC分类号: G01K1/14 G01K13/024

    CPC分类号: G01K1/14 G01K13/024

    摘要: The installation structure of a sensor includes a sensor body, a holder provided with a locking part and configured to install the sensor body by locking the sensor body with the locking part, the locking part configured to deform when installing the sensor body to the holder and configured to restore when installation of the sensor body to the holder is completed, and a holder-installation body provided with an installable portion where the holder is to be installed and configured to prevent a deformation of the locking part of the holder.

    Tubular wire shielding for an exhaust gas temperature sensor arrangement, exhaust gas temperature sensor arrangement and method for assembling an exhaust gas temperature sensor arrangement

    公开(公告)号:US11846547B2

    公开(公告)日:2023-12-19

    申请号:US17350130

    申请日:2021-06-17

    申请人: Danfoss A/S

    发明人: Tom Christensen

    摘要: The present invention relates to a tubular wire shielding (9) for an exhaust gas temperature sensor arrangement (1), the tubular wire shielding (9) comprising a first shielding tube (13) comprising one or more through channels for accommodating one or more wires (6a, 6b, 8a, 8b, 11a, 11b) and/or for accommodating one or more temperature measurement sensors (7), the tubular wire shielding (9) furthermore comprising a second shielding tube (14) radially surrounding the first shielding tube (14). It is an object of the invention to provide a tubular wire shielding (9) and an exhaust temperature sensor arrangement (1) which are of good mechanical stability. The object is solved in that the tubular wire shielding (9) comprises a first tube adhesive layer (15) arranged interposed between the first shielding tube (13) and the second shielding tube (14), the first tube adhesive layer (15) fixing the first shielding tube to the second shielding tube (14). Furthermore, the object is solved by an exhaust gas temperature sensor arrangement (1), preferably comprising such a wire shielding (9), and a method for assembling the exhaust gas temperature sensor arrangement (1).

    Apparatus for testing semiconductor device and method of testing thereof

    公开(公告)号:US11626184B2

    公开(公告)日:2023-04-11

    申请号:US16865949

    申请日:2020-05-04

    发明人: Chen-Yen Tsai

    摘要: An apparatus for performing thermal testing of a memory device and a method of thermally testing the memory device. The apparatus includes a tester; an interface board disposed over the tester and configured to receive the semiconductor device and connect the semiconductor device to the tester; a shield disposed over the interface board and including a recess; a gas-supplying unit including a conduit extending through the shield and accessible to the recess; a temperature-sensing device disposed within the recess; and a controller configured to control and communicate with the tester, the gas-supplying unit and the temperature-sensing device.